DOWSIL™ DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR
Electrically & Thermal Conductive, High thermal conductive／ good adhesion with Ni and Al.
| Characteristics： | Conductive silver glue |
|---|---|
| Market application： | Semiconductor |
| Market application 2： | Optical Components |
| Color： | Gray |
| Compliance： | No |
| Brands： | DOW |
Appearance：Gray
Viscosity(mPa.s )：103,000
Useful temperature ranges (℃)：-45℃~+200℃
Storage condition：-10 ~ -25°C
Hardness(Shore)：A91
Package：35G／SYR110G／SYR
Main application：High thermal die attach and TIM1
Application description：Application: MEMS and FCBGA TIM1
Curing condition：120minute@150°C
Mix ratio：One Part
Shelf life：4months
Specific Gravity(g／cm3)：4.4
Thermal Conductivity(Watts／meter℃)：6.8
Working Time(@25℃／hr)：48
Transition Temperature(Tg)：-125
Specific Gravity(g／ML)：4.4
Thixotropy index：2
Cure conduction：2Hrs@150℃