DOWSIL™ DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR
Electrically & Thermal Conductive, High thermal conductive/ good adhesion with Ni and Al.
Characteristics: | Conductive silver glue |
---|---|
Market application: | Semiconductor |
Market application 2: | Optical Components |
Color: | Gray |
Compliance: | No |
Brands: | DOW |

Appearance:Gray
Viscosity(mPa.s ):103,000
Useful temperature ranges (℃):-45℃~+200℃
Storage condition:-10 ~ -25°C
Hardness(Shore):A91
Package:35G/SYR110G/SYR
Main application:High thermal die attach and TIM1
Application description:Application: MEMS and FCBGA TIM1
Curing condition:120minute@150°C
Mix ratio:One Part
Shelf life:4months
Specific Gravity(g/cm3):4.4
Thermal Conductivity(Watts/meter℃):6.8
Working Time(@25℃/hr):48
Transition Temperature(Tg):-125
Specific Gravity(g/ML):4.4
Thixotropy index:2
Cure conduction:2Hrs@150℃