環氧樹脂 產品目錄

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  1. SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN
    SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN

    低黏度、透光性佳、絶緣性良好、耐候性高

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

  2. SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR
    SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR

    本產品是針對電子製品所開發,覆晶封裝用的單液型環氧樹脂。具有良好的操作性,可廣泛應用在電子產品的灌注,填縫和封裝。

    This product is developed for electronic products, flip-chip package with a single-part epoxy resin. Has good operability, can be widely used in electronic products perfusion, caulking and packaging.

  3. SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
    SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

    對於CSP、BGA晶片做底填時,可以緩衝錫球接點的膨脹收縮應力,並可以緩衝摔落測試時的反作用力傳導的剪力。

    For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.

  4. SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1
    SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1

    低黏度、透光性佳、絶緣性良好、耐候性高

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

  5. SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR
    SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR

    本產品是針對電子製品所開發,覆晶封裝用的單液型環氧樹脂 為無溶劑型單液環氧樹脂,完全不含揮發性物質,不會釋放毒素。在溫度80oC時具有良好的滲透性。固化後具有良好的低收縮性。固化後對於氣態和液態的水分都具有良好的抵抗能力。符合EC RoHS法規規範。符合氯<900ppm,溴<900ppm,氯+溴<1500ppm

    This product is developed for electronic products,flip-chip package with a one-part epoxy solvent-free single liquid epoxy resin, completely free of volatile substances,it will not release toxins.

    It has good permeability when the temperature is 80oC. After curing has excellent low shrinkage. After curing for gaseous and liquid water has a good resistance. Compliance with EC RoHS norms and regulations. Compliance with chlorine <900ppm,bromine <900ppm, chlorine + bromine <1500ppm

  6. FONG YONG E 536 EPOXY POTTING RESIN BLACK,5KG-CAN 100:30
    FONG YONG E 536 EPOXY POTTING RESIN BLACK,5KG-CAN 100:30

    耐高壓,耐溫150℃

    high voltage resistance,high temperature resistance up to 150℃

  7. FONG YONG H536 EPOXY CURING AGENT LIGHT AMBER,300G-CAN 100:30
    FONG YONG H536 EPOXY CURING AGENT LIGHT AMBER,300G-CAN 100:30

    耐高壓,耐溫150℃

    high voltage resistance,high temperature resistance up to 150℃

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