半導體封裝 產品目錄

導電銀膠

Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles

高導熱導電銀膠

TIM 1, High thermal conductive 60W／mk with oven curing or reflow process

Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

奈米級底部填充

Filler size <5nm

Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

錫球保護材料, 取代Under Fill

Applied by Dipping, screen printing and dispensing

Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material

無溶劑的IC晶片保護膠,具良好光學特性與耐冷熱衝擊特性

-混合比:1:1, 2:1, 10:1,

-混合後黏度:4900-5800 m.Pas

Optical properties.

Mixing Ratio:1:1, 2:1, 10:1

Mixed iscosity:4900-5800 m.Pas

可UV 固化型矽凝膠

UV curable silicone gel

氟素矽膠. 具耐油性與抗腐蝕

fluoropolymer type, Resistance to oil and corrosion resistance

高純度,是非揮發性矽膠的液體溶劑,可在室溫下完成蒸發,不會有殘留物,不破壞臭氧層,使用中不會產生煙霧,無味。高純度,可在室溫下可完全蒸發

High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents

低功率＆導電銀膠

Low thermal conductive and long work life