半導體封裝 產品目錄

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  1. DOWSIL™ 7920 BLACK SDA,10G-SYR
    DOWSIL™ 7920 BLACK SDA,10G-SYR

    導熱絕緣膠,低應力膠材,適用於 MEMS產品應用。

    Insulation,Low modulus and CTE.

  2. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    高導熱導電銀膠

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process

  3. YINCAE SMT 256 EP/SMT 138 EP
    YINCAE SMT 256 EP/SMT 138 EP

    Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

  4. YINCAE SMT 158
    YINCAE SMT 158

    奈米級底部填充

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  5. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    錫球保護材料, 取代Under Fill

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

  6. DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1
    DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1

    無溶劑的IC晶片保護膠,具良好光學特性與耐冷熱衝擊特性

    -混合比:1:1, 2:1, 10:1,

    -混合後黏度:4900-5800 m.Pas

    Optical properties.

    Mixing Ratio:1:1, 2:1, 10:1

    Mixed iscosity:4900-5800 m.Pas

  7. DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT
    DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT

    氟素矽膠. 具耐油性與抗腐蝕

    fluoropolymer type, Resistance to oil and corrosion resistance

  8. PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR
    PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR

    絕緣膠/高接著力/具導熱效果

    Non-conductive. Good adhesion and thermal conducitvy 1W/Mk

項目1-1028

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