半導體封裝 產品目錄

導熱絕緣膠,低應力膠材,適用於 MEMS產品應用。

Insulation,Low modulus and CTE.

高導熱導電銀膠

TIM 1, High thermal conductive 60W／mk with oven curing or reflow process

Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

奈米級底部填充

Filler size <5nm

Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

錫球保護材料, 取代Under Fill

Applied by Dipping, screen printing and dispensing

Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material

無溶劑的IC晶片保護膠,具良好光學特性與耐冷熱衝擊特性

-混合比:1:1, 2:1, 10:1,

-混合後黏度:4900-5800 m.Pas

Optical properties.

Mixing Ratio:1:1, 2:1, 10:1

Mixed iscosity:4900-5800 m.Pas

可UV 固化型矽凝膠

UV curable silicone gel

氟素矽膠. 具耐油性與抗腐蝕

fluoropolymer type, Resistance to oil and corrosion resistance

低功率＆導電銀膠

Low thermal conductive and long work life

絕緣膠／高接著力／具導熱效果

Non-conductive.　Good adhesion　and thermal conducitvy　1W／Mk