基本上，各式各樣的鏡片與鏡頭就已普遍應用在很多的影像產 品，任何影像產品也絕對需要光學鏡片或鏡頭，這些影像產品包括 了眼鏡、傳統相機、望遠鏡、顯微鏡、影印機、傳真機、雷射印表機、掃描器、條碼掃描器、電腦相機 (PC Camera)、攝影機、保全攝 影機，和投影機，以及近年市場大幅成長的數位相機與影像手機。 甚至在各式光碟機 (CD／ DVD Player，CD／ DVD-ROM Drive)和光通 訊元件裡也都需要光學鏡片。
現今光學鏡片必須搭配日益小型化的 CCD、CMOS 等影像感測器，或光碟機，使得光學鏡片的精密程度乃甚 高於傳統的眼鏡等光學器材。
光學元件分類方式 從天文望遠鏡的大型鏡頭到光學讀取頭裡的小型繞射光學元 件，以及精度要求各有所不同的玻璃鏡片或塑膠鏡片、球面鏡或非 球面鏡等，這些光學產品所需要的光學元件可謂琳瑯滿目，依其技 術原理分類，大致上可分做 (1)幾何光學元件、 (2)繞射光學元件，和 (3)干涉光學元件，以及 (4)偏振光學元件等。以材質之不同大約可分為玻璃與塑膠兩類。
而若再以鏡片的形狀分類則又可為球面鏡與非球面鏡，所以光學元件有幾種不同的分類，幾種分類的方式如下，這幾種分類方式彼此並不互斥。
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PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR快速固化導電／銀膠／低模量
Fast cure／Electrically／Low modulus
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PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR絕緣膠,二階段烘烤與玻璃、塑料及陶瓷及金屬有良好接著
Non-conductive. B-stage type Good adhesion with Glass／PC／LCP／Cermaic／Metal
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PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR快速固化＆導電銀膠
Snap cure electrically conductive & Thermal Conductive
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PROTAVIC PVIC ACE 44071LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1003Y=10G-SYR低溫固化＆導電銀膠
Electrically conductive and Low Temp.
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PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR低溫固化＆導電銀膠
Electrically conductive and Low Temp.
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PROTAVIC PVIC ACH24053 DIE ATTACH ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1010Y=33G-SYR導電銀膠
Electrically & Thermal Conductive
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PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR絕緣膠, 與玻璃、塑料及陶瓷有良好接著
Non-conductive. Good adhesion with Glass／PC／LCP／Cermaic
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PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR絕緣膠,具紅外線阻絕,與塑料及陶瓷有良好接著
Non-conductive. IR cut. Good adhesion with PC／LCP／Cermaic
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PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR低溫固化絕緣膠
Non-conductive. Low temperature cured. Good adhesion for die bonding and horder bond
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PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR低溫固化＆導電銀膠
Electrically conductive and Low Temp. cure
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DOW CORNING DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR導電銀膠,具導熱接著,對鎳／鋁／壓層板有良好接著能力
Electrically & Thermal Conductive, High thermal conductive／ good adhesion with Ni and Al.
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DOW CORNING DA 6633 PRINTABLE MICROELECTRONIC ADHESIVE WHITE,170G-CRT導熱絕緣膠,為BOC 膠材,不含溶劑,使用網印製程,取代一般B-Stage 膠材
Insulation, Solvent free／ A-stage, screen printing process
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DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR絕緣接著,具高接著強度,可耐迴銲製程製程接著膠。
Insulation Adhesive, High temperature lidseal and heat sink attach adhesive designed for Pb-free reflow conditions such as 260C.
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DOW CORNING R 6102 HIPEC BLACK,453G-CAN黑色晶片保護膠,低黏度熱固型,具良好的熱穩定性
Black, IC Coating, Encapsulant／ Low viscosity／ High thermostability
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PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR導電銀膠
Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles
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PROTAVIC PVIC ACH 35001LV SILVER WHITE,4CC=16G-SYR高功率&導電銀膠
High thermal conductive ／ High adhesion strength on hot temperature
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PROTAVIC PVIC ACH 35006 ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=40G-SYR繞結銀膠
Sintering silver non-solvent,good workability
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PROTAVIC PVIC ANH 25701 DIE ATTACH_NON-CONDUCTIVE CREAMY YELLOW,EFD 1005=7.5G-SYR絕緣膠&低模量膠材
Non-conductive. Low modulus
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PROTAVIC PVIC ANH 34056 DIE ATTACH_NON-CONDUCTIVITY CLEAR,5CC=5G-SYR絕緣膠高Tg,高接著張度
Non-conductive. High Tg／ Good adhesion
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PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR絕緣膠／高接著力／具導熱效果
Non-conductive. Good adhesion and thermal conducitvy 1W／Mk
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PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR低功率＆導電銀膠
Low thermal conductive and long work life
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DOWSIL™ Q2-1345 DILUENT,340G-CAN高純度,是非揮發性矽膠的液體溶劑,可在室溫下完成蒸發,不會有殘留物,不破壞臭氧層,使用中不會產生煙霧,無味。高純度,可在室溫下可完全蒸發
High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents
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DOW CORNING OE 8011 OPTICAL DIE ATTACH LOW 9PL TRANSLUCENT,10G-SYR耐黃變,低分子揮發,高接著強度,熱穩定性高
Non-yellowing ／ low outgassing／ Good adhesion／ High thermostability
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DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR具導熱特性,熱穩定性高
Thermal conductive／ High thermostability
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DOW CORNING OE 6551 A-B OPTICAL ENCAPSULANT雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOW CORNING OE 6630 A-B TRANSPARENT SILICONE RESIN雙液熱固光學級矽膠
Two part heat curable optical grade silicone resin
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DOW CORNING OE 6631 A-B SILICONE OPTICAL RESIN CLEAR K雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOW CORNING OE 6635 A-B TRANSPARENT SILICONE RESIN雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOW CORNING OE 6636 A-B SILICONE OPTICAL MATERIAL CLEAR K雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOW CORNING OE 6650 A-B RESIN CLEAR雙液熱固光學級矽膠
Two part heat curable optical grade silicone resin
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DOW CORNING OE 6652 A-B OPTICAL ENCAPSULANT CLEAR雙液熱固光學級矽膠
Two part heat curable optical grade silicone resin
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DOW CORNING OE 6662 A-B OPTICAL ENCAPSULANT雙液熱固光學級矽膠
Two part heat curable optical grade silicone resin
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DOW CORNING OE 7640 A-B OPTICAL ENCAPSULANT D-45 CLEAR雙液熱固光學級矽膠
Two part heat curable optical grade silicone resin
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DOW CORNING OE 7662 A-B OPTICAL ENCAPSULANT CLEAR雙液熱固光學級矽膠
Two part heat curable optical grade silicone resin
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DOW CORNING OE 7840 A-B OPTICAL ENCAPSULANT CLEAR,1650G-KIT 1:10雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOW CORNING OE 7841 A-B OPTICAL ENCAPSULANT COLOURLESS雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOW CORNING SR 7010 A-B POT RESIN CLEAR,2KG-KIT 1:1雙液熱固光學級矽膠
Two part heat curable optical grade silicone resin
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DOW CORNING WR 3100 A-B DIE EDGE COAT WHITE,110G-KIT 1:10雙液熱固型高反射矽樹脂
Two part silicone heat curable high reflective resin
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DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT氟素矽膠. 具耐油性與抗腐蝕
fluoropolymer type, Resistance to oil and corrosion resistance
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SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR對於CSP、BGA晶片做底填時,可以緩衝錫球接點的膨脹收縮應力,並可以緩衝摔落測試時的反作用力傳導的剪力。
For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.
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SIL-MORE EPO-SIL 1847 A IR CUT PLASTIC PACKAGING MATERIAL GREEN,4KG-CAN本產品為含有紅外線遮蔽物質的環氧樹脂封裝膠材,擁有使用時間長,封裝後具高可見光穿透度和優異的不可見光遮蔽性質。
This product is an epoxy resin material containing near infrared cutting material, which has long pot life and excellent invisible light shielding properties.
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DOW CORNING OE 6351 A-B SILICONE ENCAPSULANT CLEAR雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOW CORNING OE 6370HF A-B COMPRESSION MOLD FAST CURE 6000CPS雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOW CORNING OE 6370M A-B DISPENSOR 3500CPS CLEAR雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOW CORNING OE 7340 A-B OPTICAL ENCAPSULANT PALE YELLOW雙液熱固光學級矽膠
Two part heat curable optical grade silicone
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DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1無溶劑的IC晶片保護膠,具良好光學特性與耐冷熱衝擊特性
-混合比:1:1, 2:1, 10:1,
-混合後黏度:4900-5800 m.Pas
Optical properties.
Mixing Ratio:1:1, 2:1, 10:1
Mixed iscosity:4900-5800 m.Pas
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YINCAE SMT 256／BP256錫球保護材料, 取代Under Fill
Applied by Dipping, screen printing and dispensing
Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material
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YINCAE SMT 158奈米級底部填充
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
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YINCAE SMT 256 EP／SMT 138 EPSelf -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.
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YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR高導熱導電銀膠
TIM 1, High thermal conductive 60W／mk with oven curing or reflow process
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DOW CORNING WR 3001 A-B DIE EDGE COAT WHITE,60G-KIT 1:1雙液熱固型高反射彈性矽膠
Two part silicone heat curable high reflective elastomer
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SIL-MORE AD 711 WHITE,100G-CAN混合後彽黏度灌注／電器性質良好／無溶劑（100% solid content）／室溫硬化（升溫可加速反應）／灌注後發泡,體積膨脹約1.5倍
Low initial viscosity after mixing solvent-free casting resin)／Good electrical characteristics／Solvent-free（100% solid content）／The reaction of the mixtures is started in room temperatures（The reaction is accelerated during higher temperatures）／The volume of the resin expanded about 150% after casting
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