環氧樹脂 產品目錄

上膠後基材不會產生滑移現象,適用在增加基材厚度。

Does not slip phenomenon glue for increasing the substrate thickness

低黏度、電性佳、絶緣性良好

Low viscosity, Good Insulation

快速固化接著

Fast cure structral bonding

具有低溫快速硬化、中等黏度,在加工與硬化的過程中不會任意垂流。

This resin can be fast cured at low temperature, is able to reduce the working time and increase the efficiency at the same time. It has moderate viscosity, in the process of the curing process and will not be any vertical.

具有優異的接著強度,耐油性,耐溶劑等性質。

Good adhesive , Good oil resistance and good solvent resistance

高接著強度(AL) 、加熱固化.

High adhesion strength、Heat cure

高接著強度 、加熱固化

High adhesion strength、Heat cure