YINCAE SMT 256／BP256
錫球保護材料, 取代Under Fill
Applied by Dipping, screen printing and dispensing
Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material
| 特性： | 無鉛應用/替換底部填充材料 |
|---|---|
| 市場應用： | 半導體 |
| 市場應用2： | 光學元件 |
| 顏色： | 透明色／黑色 |
| 認證： | RoHS／HF |
| 品牌： | YINCAE |
