YINCAE SMT 158
奈米級底部填充
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
特性: | 奈米級底部填充 |
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市場應用: | 半導體 |
市場應用2: | 光學元件 |
顏色: | 白色/黑色 |
認證: | RoHS/HF |
品牌: | YINCAE |
