YINCAE SMT 158
奈米級底部填充
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
| 特性： | 奈米級底部填充 |
|---|---|
| 市場應用： | 半導體 |
| 市場應用2： | 光學元件 |
| 顏色： | 白色／黑色 |
| 認證： | RoHS／HF |
| 品牌： | YINCAE |
