SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR
本產品是針對電子製品所開發,覆晶封裝用的單液型環氧樹脂。具有良好的操作性,可廣泛應用在電子產品的灌注,填縫和封裝。
This product is developed for electronic products, flip-chip package with a single-part epoxy resin. Has good operability, can be widely used in electronic products perfusion, caulking and packaging.
特性: | 覆晶封裝用 |
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市場應用: | 消費性產品 |
市場應用2: | 一般行業(通用產業) |
顏色: | 黑色 |
認證: | 否 |
品牌: | SIL-MORE |
