環氧樹脂
篩選產品
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PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR絕緣膠,二階段烘烤與玻璃、塑料及陶瓷及金屬有良好接著
Non-conductive. B-stage type Good adhesion with Glass／PC／LCP／Cermaic／Metal
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PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR絕緣膠, 與玻璃、塑料及陶瓷有良好接著
Non-conductive. Good adhesion with Glass／PC／LCP／Cermaic
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PROTAVIC 668-3S SILVER, 5CC=16.5G-SYR低功率&導電銀膠
Low thermal conductive and long work life
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PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR快速固化導電／銀膠／低模量
Fast cure／Electrically／Low modulus
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PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR低溫固化＆導電銀膠
Electrically conductive and Low Temp.
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PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR低溫固化＆導電銀膠
Electrically conductive and Low Temp. cure
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YINCAE SMT 158奈米級底部填充
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
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PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR快速固化＆導電銀膠
Snap cure electrically conductive & Thermal Conductive
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PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR絕緣膠,具紅外線阻絕,與塑料及陶瓷有良好接著
Non-conductive. IR cut. Good adhesion with PC／LCP／Cermaic
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PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR低功率＆導電銀膠
Low thermal conductive and long work life
