環氧樹脂
篩選產品
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PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR絕緣膠,具紅外線阻絕,與塑料及陶瓷有良好接著
Non-conductive. IR cut. Good adhesion with PC／LCP／Cermaic
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PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR低功率＆導電銀膠
Low thermal conductive and long work life
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YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR高導熱導電銀膠
TIM 1, High thermal conductive 60W／mk with oven curing or reflow process
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PROTAVIC PVIC ACH24053 DIE ATTACH ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1010Y=33G-SYR導電銀膠
Electrically & Thermal Conductive
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PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR導電銀膠
Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles
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YINCAE SMT 256 EP／SMT 138 EPSelf -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.
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PROTAVIC PVIC ACE 44071LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1003Y=10G-SYR低溫固化＆導電銀膠
Electrically conductive and Low Temp.
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PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR低溫固化絕緣膠
Non-conductive. Low temperature cured. Good adhesion for die bonding and horder bond
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YINCAE SMT 256／BP256錫球保護材料, 取代Under Fill
Applied by Dipping, screen printing and dispensing
Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material
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PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR絕緣膠,二階段烘烤與玻璃、塑料及陶瓷及金屬有良好接著
Non-conductive. B-stage type Good adhesion with Glass／PC／LCP／Cermaic／Metal
