環氧樹脂
- PROTAVIC 668-3S SILVER, 5CC=16.5G-SYR
低功率&導電銀膠
Low thermal conductive and long work life
- PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR
快速固化導電/銀膠/低模量
Fast cure/Electrically/Low modulus
- PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR
低溫固化&導電銀膠
Electrically conductive and Low Temp.
- PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR
低溫固化&導電銀膠
Electrically conductive and Low Temp. cure
- YINCAE SMT 158
奈米級底部填充
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
- PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR
快速固化&導電銀膠
Snap cure electrically conductive & Thermal Conductive
- PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR
絕緣膠,具紅外線阻絕,與塑料及陶瓷有良好接著
Non-conductive. IR cut. Good adhesion with PC/LCP/Cermaic
- PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR
低功率&導電銀膠
Low thermal conductive and long work life
- YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
高導熱導電銀膠
TIM 1, High thermal conductive 60W/mk with oven curing or reflow process
- PROTAVIC PVIC ACH24053 DIE ATTACH ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1010Y=33G-SYR
導電銀膠
Electrically & Thermal Conductive