半導體封裝
篩選產品
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DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1無溶劑的IC晶片保護膠,具良好光學特性與耐冷熱衝擊特性
-混合比:1:1, 2:1, 10:1,
-混合後黏度:4900-5800 m.Pas
Optical properties.
Mixing Ratio:1:1, 2:1, 10:1
Mixed iscosity:4900-5800 m.Pas
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DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT氟素矽膠. 具耐油性與抗腐蝕
fluoropolymer type, Resistance to oil and corrosion resistance
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DOWSIL™ 7920 BLACK SDA,10G-SYR導熱絕緣膠,低應力膠材,適用於 MEMS產品應用。
Insulation,Low modulus and CTE.
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DOWSIL™ Q2-1345 DILUENT,340G-CAN高純度,是非揮發性矽膠的液體溶劑,可在室溫下完成蒸發,不會有殘留物,不破壞臭氧層,使用中不會產生煙霧,無味。高純度,可在室溫下可完全蒸發
High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents
