環氧樹脂 產品目錄

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設置降序順序

篩選產品

  1. SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
    SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

    對於CSP、BGA晶片做底填時,可以緩衝錫球接點的膨脹收縮應力,並可以緩衝摔落測試時的反作用力傳導的剪力。

    For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.

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設置降序順序