灌注密封
篩選產品
- SIL-MORE EU 101 FLEXIBLE PU RESIN CLEAR,5KG-CAN 1:1
具有耐陽光紫外線,室外長時間曝曬不變黃之優點
Flexible type for 3D doming ,potting with excellent UV resistance
- SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
對於CSP、BGA晶片做底填時,可以緩衝錫球接點的膨脹收縮應力,並可以緩衝摔落測試時的反作用力傳導的剪力。
For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.