灌注密封 產品目錄

對於CSP、BGA晶片做底填時,可以緩衝錫球接點的膨脹收縮應力,並可以緩衝摔落測試時的反作用力傳導的剪力。

For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.

具有耐陽光紫外線,室外長時間曝曬不變黃之優點

Flexible type for 3D doming ,potting with excellent UV resistance