灌注密封 產品目錄

具有耐陽光紫外線,室外長時間曝曬不變黃之優點

Flexible type for 3D doming ,potting with excellent UV resistance

對於CSP、BGA晶片做底填時,可以緩衝錫球接點的膨脹收縮應力,並可以緩衝摔落測試時的反作用力傳導的剪力。

For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.