環氧樹脂 產品目錄

項目1-1017

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  1. PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR
    PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR

    快速固化&導電銀膠

    Snap cure electrically conductive & Thermal Conductive

  2. PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR
    PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR

    絕緣膠,具紅外線阻絕,與塑料及陶瓷有良好接著

    Non-conductive. IR cut. Good adhesion with PC/LCP/Cermaic

  3. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    高導熱導電銀膠

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process

  4. PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR
    PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR

    導電銀膠

    Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles

  5. YINCAE SMT 256 EP/SMT 138 EP
    YINCAE SMT 256 EP/SMT 138 EP

    Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

  6. PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR
    PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR

    低溫固化絕緣膠

    Non-conductive. Low temperature cured. Good adhesion for die bonding and horder bond

  7. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    錫球保護材料, 取代Under Fill

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

項目1-1017

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