Epoxy Base Product Catalog

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  1. PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR
    PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR

    Non-conductive. Low temperature cured. Good adhesion for die bonding and horder bond

  2. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

  3. PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR
    PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR

    Non-conductive. B-stage type Good adhesion with Glass/PC/LCP/Cermaic/Metal

  4. YINCAE SMT 158
    YINCAE SMT 158

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

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