環氧樹脂 產品目錄

項目1-1017

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  1. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    錫球保護材料, 取代Under Fill

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

  2. PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR
    PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR

    絕緣膠,二階段烘烤與玻璃、塑料及陶瓷及金屬有良好接著

    Non-conductive. B-stage type Good adhesion with Glass/PC/LCP/Cermaic/Metal

  3. PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR
    PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR

    絕緣膠, 與玻璃、塑料及陶瓷有良好接著

    Non-conductive. Good adhesion with Glass/PC/LCP/Cermaic

  4. PROTAVIC 668-3S SILVER, 5CC=16.5G-SYR
    PROTAVIC 668-3S SILVER, 5CC=16.5G-SYR

    低功率&導電銀膠

    Low thermal conductive and long work life

  5. YINCAE SMT 158
    YINCAE SMT 158

    奈米級底部填充

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  6. PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR
    PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR

    快速固化&導電銀膠

    Snap cure electrically conductive & Thermal Conductive

  7. PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR
    PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR

    絕緣膠,具紅外線阻絕,與塑料及陶瓷有良好接著

    Non-conductive. IR cut. Good adhesion with PC/LCP/Cermaic

項目1-1017

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