YINCAE SMT 256／BP256
錫球保护材料, 取代Under Fill
Applied by Dipping, screen printing and dispensing
Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material
| 特性： | 无铅应用/替换底部填充材料 |
|---|---|
| 市场应用： | 半导体 |
| 市场应用2： | 光学元件 |
| 颜色： | 透明色／黑色 |
| 认证： | RoHS／HF |
| 品牌： | YINCAE |
