矽胶 加成型
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DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1无溶剂的IC晶片保护胶,具良好光学特性与耐冷热冲击特性
-混合比:1:1, 2:1, 10:1,
-混合后黏度:4900-5800 m.Pas
Optical properties.
Mixing Ratio:1:1, 2:1, 10:1
Mixed iscosity:4900-5800 m.Pas
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DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT氟素矽胶. 具耐油性与抗腐蝕
fluoropolymer type, Resistance to oil and corrosion resistance
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DOW CORNING Q1-9239 CHARCOAL GRAY,1KG-CAN黑色,高黏度具搖變性保护胶
Black adhesive／ High viscosity.
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DOWSIL™ 7920 BLACK SDA,10G-SYR导热絕緣胶,低应力胶材,适用于 MEMS产品应用。
Insulation,Low modulus and CTE.
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DOW CORNING DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR导电銀胶,具导热接着,对鎳／铝／压层板有良好接着能力
Electrically & Thermal Conductive, High thermal conductive／ good adhesion with Ni and Al.
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DOW CORNING R 6102 HIPEC BLACK,453G-CAN黑色晶片保护胶,低黏度热固型,具良好的热穩定性
Black, IC Coating, Encapsulant／ Low viscosity／ High thermostability
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DOWSIL™ Q2-1345 DILUENT,340G-CAN高纯度,是非揮发性矽胶的液体溶剂,可在室温下完成蒸发,不会有殘留物,不破坏臭氧层,使用中不会产生煙霧,无味。高纯度,可在室温下可完全蒸发
High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents
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DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR絕緣接着,具高接着強度,可耐迴銲制程制程接着胶。
Insulation Adhesive, High temperature Lid seal and heat sink attach adhesive designed for Pb-free reflow conditions such as 260C.
