环氧树脂 产品目录

項目1-1017

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筛选产品

  1. YINCAE SMT 158
    YINCAE SMT 158

    奈米级底部填充

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  2. PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR
    PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR

    快速固化&导电銀胶

    Snap cure electrically conductive & Thermal Conductive

  3. PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR
    PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR

    絕緣胶,具紅外线阻絕,与塑料及陶瓷有良好接着

    Non-conductive. IR cut. Good adhesion with PC/LCP/Cermaic

  4. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    高导热导电銀胶

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process

  5. PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR
    PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR

    导电銀胶

    Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles

  6. YINCAE SMT 256 EP/SMT 138 EP
    YINCAE SMT 256 EP/SMT 138 EP

    Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

項目1-1017

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