环氧树脂
筛选产品
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PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR低温固化＆导电銀胶
Electrically conductive and Low Temp. cure
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YINCAE SMT 158奈米级底部填充
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
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PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR快速固化＆导电銀胶
Snap cure electrically conductive & Thermal Conductive
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PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR絕緣胶,具紅外线阻絕,与塑料及陶瓷有良好接着
Non-conductive. IR cut. Good adhesion with PC／LCP／Cermaic
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PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR低功率＆导电銀胶
Low thermal conductive and long work life
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YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR高导热导电銀胶
TIM 1, High thermal conductive 60W／mk with oven curing or reflow process
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PROTAVIC PVIC ACH24053 DIE ATTACH ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1010Y=33G-SYR导电銀胶
Electrically & Thermal Conductive
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PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR导电銀胶
Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles
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YINCAE SMT 256 EP／SMT 138 EPSelf -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.
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PROTAVIC PVIC ACE 44071LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1003Y=10G-SYR低温固化＆导电銀胶
Electrically conductive and Low Temp.
