环氧树脂
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PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR低温固化絕緣胶
Non-conductive. Low temperature cured. Good adhesion for die bonding and horder bond
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YINCAE SMT 256／BP256錫球保护材料, 取代Under Fill
Applied by Dipping, screen printing and dispensing
Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material
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PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR絕緣胶,二階段烘烤与玻璃、塑料及陶瓷及金属有良好接着
Non-conductive. B-stage type Good adhesion with Glass／PC／LCP／Cermaic／Metal
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PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR絕緣胶, 与玻璃、塑料及陶瓷有良好接着
Non-conductive. Good adhesion with Glass／PC／LCP／Cermaic
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PROTAVIC 668-3S SILVER WHITE,33G-SYR低功率&导电銀胶
Low thermal conductive and long work life
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PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR快速固化导电／銀胶／低模量
Fast cure／Electrically／Low modulus
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PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR低温固化＆导电銀胶
Electrically conductive and Low Temp.
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PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR低温固化＆导电銀胶
Electrically conductive and Low Temp. cure
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YINCAE SMT 158奈米级底部填充
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
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PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR快速固化＆导电銀胶
Snap cure electrically conductive & Thermal Conductive
