环氧树脂
- PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR
快速固化导电/銀胶/低模量
Fast cure/Electrically/Low modulus
- PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR
低温固化&导电銀胶
Electrically conductive and Low Temp.
- PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR
低温固化&导电銀胶
Electrically conductive and Low Temp. cure
- YINCAE SMT 158
奈米级底部填充
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
- PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR
快速固化&导电銀胶
Snap cure electrically conductive & Thermal Conductive
- PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR
絕緣胶,具紅外线阻絕,与塑料及陶瓷有良好接着
Non-conductive. IR cut. Good adhesion with PC/LCP/Cermaic
- PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR
低功率&导电銀胶
Low thermal conductive and long work life
- YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
高导热导电銀胶
TIM 1, High thermal conductive 60W/mk with oven curing or reflow process
- PROTAVIC PVIC ACH24053 DIE ATTACH ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1010Y=33G-SYR
导电銀胶
Electrically & Thermal Conductive
- PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR
导电銀胶
Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles