半导体封装 产品目录

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設置降序順序

筛选产品

  1. YINCAE SMT 158
    YINCAE SMT 158

    奈米级底部填充

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  2. YINCAE SMT 256 EP/SMT 138 EP
    YINCAE SMT 256 EP/SMT 138 EP

    Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

  3. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    錫球保护材料, 取代Under Fill

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

  4. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    高导热导电銀胶

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process

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設置降序順序