半导体封装 产品目录

导热絕緣胶,低应力胶材,适用于 MEMS产品应用。

Insulation,Low modulus and CTE.

高导热导电銀胶

TIM 1, High thermal conductive 60W／mk with oven curing or reflow process

Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

奈米级底部填充

Filler size <5nm

Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

錫球保护材料, 取代Under Fill

Applied by Dipping, screen printing and dispensing

Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material

无溶剂的IC晶片保护胶,具良好光学特性与耐冷热冲击特性

-混合比:1:1, 2:1, 10:1,

-混合后黏度:4900-5800 m.Pas

Optical properties.

Mixing Ratio:1:1, 2:1, 10:1

Mixed iscosity:4900-5800 m.Pas

可UV 固化型矽凝胶

UV curable silicone gel

氟素矽胶. 具耐油性与抗腐蝕

fluoropolymer type, Resistance to oil and corrosion resistance

低功率＆导电銀胶

Low thermal conductive and long work life

絕緣胶／高接着力／具导热效果

Non-conductive.　Good adhesion　and thermal conducitvy　1W／Mk