半导体封装
- DOWSIL™ 7920 BLACK SDA,10G-SYR
导热絕緣胶,低应力胶材,适用于 MEMS产品应用。
Insulation,Low modulus and CTE.
- YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
高导热导电銀胶
TIM 1, High thermal conductive 60W/mk with oven curing or reflow process
- YINCAE SMT 256 EP/SMT 138 EP
Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.
- YINCAE SMT 158
奈米级底部填充
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
- YINCAE SMT 256/BP256
錫球保护材料, 取代Under Fill
Applied by Dipping, screen printing and dispensing
Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material
- DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1
无溶剂的IC晶片保护胶,具良好光学特性与耐冷热冲击特性
-混合比:1:1, 2:1, 10:1,
-混合后黏度:4900-5800 m.Pas
Optical properties.
Mixing Ratio:1:1, 2:1, 10:1
Mixed iscosity:4900-5800 m.Pas
- DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT
氟素矽胶. 具耐油性与抗腐蝕
fluoropolymer type, Resistance to oil and corrosion resistance
- DOWSIL™ Q2-1345 DILUENT,340G-CAN
高纯度,是非揮发性矽胶的液体溶剂,可在室温下完成蒸发,不会有殘留物,不破坏臭氧层,使用中不会产生煙霧,无味。高纯度,可在室温下可完全蒸发
High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents
- PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR
低功率&导电銀胶
Low thermal conductive and long work life