半导体(Semiconductor)

三种导电性不同的材料比较,金属的价电带与导电带之间没有距离,因此电子(红色实心圆圈)可以自由移动。绝缘体的能隙宽度最大,电子难以从价电带跃迁至导电带。半导体的能隙在两者之间,电子较容易跃迁至导电带中。

半导体(Semiconductor)指一种导电性可受控制,范围可从绝缘体至导体之间的材料。无论从科技或是经济发展的角度来看,半导体的重要性都是非常巨大的。今日大部分的电子产品,如:计算机、行动电话或是数位录音机当中的核心单元都和半导体有着极为密切的关连。常见的半导体材料有矽、锗、砷化镓等,而矽更是各种半导体材料中,在商业应用上最具有影响力的一种。

材料的导电性是由导带中含有的电子数量决定。当电子从价带获得能量而跳跃至导电带时,电子就可以在带间任意移动而导电。一般常见的金属材料其导电带与价电带之间的能隙非常小,在室温下电子很容易获得能量而跳跃至导电带而导电,而绝缘材料则因为能隙很大(通常大于9电子伏特),电子很难跳跃至导电带,所以无法导电。

一般半导体材料的能隙约为1至3电子伏特,介于导体和绝缘体之间。因此只要给予适当条件的能量激发,或是改变其能隙之间距,此材料就能导电。

半导体通过电子传导或电洞传导的方式传输电流。电子传导的方式与铜线中电流的流动类似,即在电场作用下高度电离的原子将多余的电子向着负离子化程度比较低的方向传递。电洞导电则是指在正离子化的材料中,原子核外由于电子缺失形成的「电洞」,在电场作用下,电洞被少数的电子补入而造成电洞移动所形成的电流(一般称为正电流)。

材料中载子(carrier)的数量对半导体的导电特性极为重要。这可以通过在半导体中有选择的加入其他「杂质」(IIIA、VA族元素)来控制。如果我们在纯矽中掺杂(doping)少许的砷或磷(最外层有5个电子),就会多出1个自由电子,这样就形成N型半导体;如果我们在纯矽中掺入少许的硼(最外层有3个电子),就反而少了1个电子,而形成一个电洞(hole),这样就形成P型半导体(少了1个带负电荷的原子,可视为多了1个正电荷)。

近十年来,半导体的发展由早期的电脑产业延伸到智慧型装置与物联网的应用下持续发酵,更在近年来更带动车联网与AI科技发展, 并逐渐成为下一个发展领域重点,在技术上屡有重大突破。因此IC本身的功能愈益多元复杂,相对IC封装的可靠度要求也更加严苛。

乔越实业股份有限公司在既有的支架型(Lead Frame Base)与基板型(Substrate Base)封装已经有完善的封装胶材整合方案,现今为满足先进封装与高阶产品的技术应用,其产品线包括DOWSIL,XIAMETER,PROTAVIC,YINCAE,PANAXEM,AOS等国际知名胶材供应商。在产品应用上包含:固晶胶Die Attach(导电与绝缘)/晶片保护胶Die Coating、Encapsulant(绝缘)/导热封装胶Thermal Interface Material (导电与绝缘)/金属盖接着Lid Seal、Attach (导电与绝缘)/暂接着保护胶Wafer Temporary Bonding(绝缘)/底部填充胶Under Fill、Epoxy Flux(绝缘)/烧结银胶与新型态锡膏New Sintering Silver glue and Solder Paste(导电)。

乔越实业股份有限公司为专业胶材代理商,不仅考量半导体产业的前端制程封装胶材应用,更为了协助客户可进行快速分析异常,同时提供DYNALOY除胶剂及除胶液(Remover/Stripper),可清除Cured Epoxy, Silicone, PU, Acrylic等,以利客户精准分析。在全球产业布局上,更与策略伙伴KRAYDEN进行海外市场合作,可以为客户及终端客户提供更无缝接轨的全球销售网络服务。

在充满挑战与封装技术日新月异的半导体领域,需要具有全方位胶材方案且能及时解决客户胶材需求的供应商,乔越实业一直在制程中扮演关关键材料的的供应角色,提供封装胶材解决方案与客户共同开发新应用胶材,是半导体产业中最信赖的合作伙伴。

  1. PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR
    PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR

    快速固化导电/銀胶/低模量

    Fast cure/Electrically/Low modulus

  2. PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR
    PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR

    絕緣胶,二階段烘烤与玻璃、塑料及陶瓷及金属有良好接着

    Non-conductive. B-stage type Good adhesion with Glass/PC/LCP/Cermaic/Metal

  3. PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR
    PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR

    快速固化&导电銀胶

    Snap cure electrically conductive & Thermal Conductive

  4. PROTAVIC PVIC ACE 44071LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1003Y=10G-SYR
    PROTAVIC PVIC ACE 44071LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1003Y=10G-SYR

    低温固化&导电銀胶

    Electrically conductive and Low Temp.

  5. PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR
    PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR

    低温固化&导电銀胶

    Electrically conductive and Low Temp.

  6. PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR
    PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR

    絕緣胶, 与玻璃、塑料及陶瓷有良好接着

    Non-conductive. Good adhesion with Glass/PC/LCP/Cermaic

  7. PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR
    PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR

    絕緣胶,具紅外线阻絕,与塑料及陶瓷有良好接着

    Non-conductive. IR cut. Good adhesion with PC/LCP/Cermaic

  8. PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR
    PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR

    低温固化絕緣胶

    Non-conductive. Low temperature cured. Good adhesion for die bonding and horder bond

  9. PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR
    PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR

    低温固化&导电銀胶

    Electrically conductive and Low Temp. cure

  10. DOW CORNING DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR
    DOW CORNING DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR

    导电銀胶,具导热接着,对鎳/铝/压层板有良好接着能力

    Electrically & Thermal Conductive, High thermal conductive/ good adhesion with Ni and Al.

  11. DOW CORNING DA 6633 PRINTABLE MICROELECTRONIC ADHESIVE WHITE,170G-CRT
    DOW CORNING DA 6633 PRINTABLE MICROELECTRONIC ADHESIVE WHITE,170G-CRT

    导热絕緣胶,为BOC 胶材,不含溶剂,使用网印制程,取代一般B-Stage 胶材

    Insulation, Solvent free/ A-stage, screen printing process

  12. DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR
    DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR

    絕緣接着,具高接着強度,可耐迴銲制程制程接着胶。

    Insulation Adhesive, High temperature Lid seal and heat sink attach adhesive designed for Pb-free reflow conditions such as 260C.

  13. DOW CORNING Q1-9239 CHARCOAL GRAY,1KG-CAN
    DOW CORNING Q1-9239 CHARCOAL GRAY,1KG-CAN

    黑色,高黏度具搖變性保护胶

    Black adhesive/ High viscosity.

  14. DOW CORNING R 6102 HIPEC BLACK,453G-CAN
    DOW CORNING R 6102 HIPEC BLACK,453G-CAN

    黑色晶片保护胶,低黏度热固型,具良好的热穩定性

    Black, IC Coating, Encapsulant/ Low viscosity/ High thermostability

  15. PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR
    PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR

    导电銀胶

    Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles

  16. DOWSIL™ 7920 BLACK SDA,10G-SYR
    DOWSIL™ 7920 BLACK SDA,10G-SYR

    导热絕緣胶,低应力胶材,适用于 MEMS产品应用。

    Insulation,Low modulus and CTE.

  17. PROTAVIC 668-3S SILVER WHITE,33G-SYR
    PROTAVIC 668-3S SILVER WHITE,33G-SYR

    低功率&导电銀胶

    Low thermal conductive and long work life

  18. PROTAVIC PVIC ACH 35001LV SILVER WHITE,4CC=16G-SYR
    PROTAVIC PVIC ACH 35001LV SILVER WHITE,4CC=16G-SYR

    高功率&导电銀胶

    High thermal conductive / High adhesion strength on hot temperature

  19. PROTAVIC PVIC ACH 35006 ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=40G-SYR
    PROTAVIC PVIC ACH 35006 ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=40G-SYR

    繞結銀胶

    Sintering silver non-solvent,good workability

  20. PROTAVIC PVIC ANH 34056 DIE ATTACH_NON-CONDUCTIVITY CLEAR,5CC=5G-SYR
    PROTAVIC PVIC ANH 34056 DIE ATTACH_NON-CONDUCTIVITY CLEAR,5CC=5G-SYR

    絕緣胶高Tg,高接着張度

    Non-conductive. High Tg/ Good adhesion

  21. PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR
    PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR

    絕緣胶/高接着力/具导热效果

    Non-conductive. Good adhesion and thermal conducitvy 1W/Mk

  22. PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR
    PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR

    低功率&导电銀胶

    Low thermal conductive and long work life

  23. DOWSIL™ Q2-1345 DILUENT,340G-CAN
    DOWSIL™ Q2-1345 DILUENT,340G-CAN

    高纯度,是非揮发性矽胶的液体溶剂,可在室温下完成蒸发,不会有殘留物,不破坏臭氧层,使用中不会产生煙霧,无味。高纯度,可在室温下可完全蒸发

    High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents

  24. DOW CORNING OE 8001 DIE ATTACH CLEAR,5G-SYR
    DOW CORNING OE 8001 DIE ATTACH CLEAR,5G-SYR

    絕緣胶,耐黃變

    Insulation. Non-yellowing

  25. DOW CORNING OE 8011 OPTICAL DIE ATTACH LOW 9PL TRANSLUCENT,10G-SYR
    DOW CORNING OE 8011 OPTICAL DIE ATTACH LOW 9PL TRANSLUCENT,10G-SYR

    耐黃變,低分子揮发,高接着強度,热穩定性高

    Non-yellowing / low outgassing/ Good adhesion/ High thermostability

  26. DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR
    DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR

    具导热特性,热穩定性高

    Thermal conductive/ High thermostability

  27. DOW CORNING OE 6551 A-B OPTICAL ENCAPSULANT
    DOW CORNING OE 6551 A-B OPTICAL ENCAPSULANT

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  28. DOW CORNING OE 6630 A-B TRANSPARENT SILICONE RESIN
    DOW CORNING OE 6630 A-B TRANSPARENT SILICONE RESIN

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  29. DOW CORNING OE 6631 A-B SILICONE OPTICAL RESIN CLEAR K
    DOW CORNING OE 6631 A-B SILICONE OPTICAL RESIN CLEAR K

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  30. DOW CORNING OE 6635 A-B TRANSPARENT SILICONE RESIN
    DOW CORNING OE 6635 A-B TRANSPARENT SILICONE RESIN

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  31. DOW CORNING OE 6636 A-B SILICONE OPTICAL MATERIAL CLEAR K
    DOW CORNING OE 6636 A-B SILICONE OPTICAL MATERIAL CLEAR K

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  32. DOW CORNING OE 6650 A-B RESIN CLEAR
    DOW CORNING OE 6650 A-B RESIN CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  33. DOW CORNING OE 6652 A-B OPTICAL ENCAPSULANT CLEAR
    DOW CORNING OE 6652 A-B OPTICAL ENCAPSULANT CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  34. DOW CORNING OE 6662 A-B OPTICAL ENCAPSULANT
    DOW CORNING OE 6662 A-B OPTICAL ENCAPSULANT

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  35. DOW CORNING OE 7640 A-B OPTICAL ENCAPSULANT D-45 CLEAR
    DOW CORNING OE 7640 A-B OPTICAL ENCAPSULANT D-45 CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  36. DOW CORNING OE 7662 A-B OPTICAL ENCAPSULANT CLEAR
    DOW CORNING OE 7662 A-B OPTICAL ENCAPSULANT CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  37. DOW CORNING OE 7840 A-B OPTICAL ENCAPSULANT CLEAR,1650G-KIT 1:10
    DOW CORNING OE 7840 A-B OPTICAL ENCAPSULANT CLEAR,1650G-KIT 1:10

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  38. DOW CORNING OE 7841 A-B OPTICAL ENCAPSULANT COLOURLESS
    DOW CORNING OE 7841 A-B OPTICAL ENCAPSULANT COLOURLESS

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  39. DOW CORNING SR 7010 A-B POT RESIN CLEAR,2KG-KIT 1:1
    DOW CORNING SR 7010 A-B POT RESIN CLEAR,2KG-KIT 1:1

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  40. DOW CORNING WR 3100 A-B DIE EDGE COAT WHITE,110G-KIT 1:10
    DOW CORNING WR 3100 A-B DIE EDGE COAT WHITE,110G-KIT 1:10

    双液热固型高反射矽樹脂

    Two part silicone heat curable high reflective resin

  41. DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT
    DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT

    氟素矽胶. 具耐油性与抗腐蝕

    fluoropolymer type, Resistance to oil and corrosion resistance

  42. DOWSIL™ X3-6211 CLEAR,175ML-CRT
    DOWSIL™ X3-6211 CLEAR,175ML-CRT

    可UV 固化型矽凝胶

    UV curable silicone gel

  43. DOW CORNING OE 6351 A-B SILICONE ENCAPSULANT CLEAR
    DOW CORNING OE 6351 A-B SILICONE ENCAPSULANT CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  44. DOW CORNING OE 6370HF A-B COMPRESSION MOLD FAST CURE 6000CPS
    DOW CORNING OE 6370HF A-B COMPRESSION MOLD FAST CURE 6000CPS

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  45. DOW CORNING OE 6370M A-B DISPENSOR 3500CPS CLEAR
    DOW CORNING OE 6370M A-B DISPENSOR 3500CPS CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  46. DOW CORNING OE 7340 A-B OPTICAL ENCAPSULANT PALE YELLOW
    DOW CORNING OE 7340 A-B OPTICAL ENCAPSULANT PALE YELLOW

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  47. DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1
    DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1

    无溶剂的IC晶片保护胶,具良好光学特性与耐冷热冲击特性

    -混合比:1:1, 2:1, 10:1,

    -混合后黏度:4900-5800 m.Pas

    Optical properties.

    Mixing Ratio:1:1, 2:1, 10:1

    Mixed iscosity:4900-5800 m.Pas

  48. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    錫球保护材料, 取代Under Fill

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

  49. YINCAE SMT 158
    YINCAE SMT 158

    奈米级底部填充

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  50. YINCAE SMT 256 EP/SMT 138 EP
    YINCAE SMT 256 EP/SMT 138 EP

    Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

  51. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    高导热导电銀胶

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process

  52. DOW CORNING WR 3001 A-B DIE EDGE COAT WHITE,60G-KIT 1:1
    DOW CORNING WR 3001 A-B DIE EDGE COAT WHITE,60G-KIT 1:1

    双液热固型高反射弹性矽胶

    Two part silicone heat curable high reflective elastomer

  53. DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,30G-SYR
    DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,30G-SYR

    粘合性佳,热稳定性高,离子杂质含量低,适用于点胶

    Excellent adhesion/High thermostability/Low levels of ionic impurities/Suitable for dispensing

  54. DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,500G-KIT 10:1
    DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,500G-KIT 10:1

    透明双剂型密封剂,粘合性佳,热稳定性高
    Two part silicone encapsulants/Excellent adhesion/High thermostability

  55. DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,10G-SYR
    DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,10G-SYR

    粘合性佳,热稳定性高,离子杂质含量低,适用于点胶

    Excellent adhesion/High thermostability/Low levels of ionic impurities/Suitable for dispensing

  56. DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,680G-KIT 2:1
    DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,680G-KIT 2:1

    透明双剂型密封剂,粘合性佳,热稳定性高
    Two part silicone encapsulants/Excellent adhesion/High thermostability