基本上,各式各样的镜片与镜头就已普遍应用在很多的影像产品,任何影像产品也绝对需要光学镜片或镜头,这些影像产品包括了眼镜、传统相机、望远镜、显微镜、影印机、传真机、雷射印表机、扫描器、条码扫描器、电脑相机(PC Camera)、摄影机、保全摄影机,和投影机,以及近年市场大幅成长的數位相机与影像手机。甚至在各式光碟机 (CD/ DVD Player,CD/ DVD-ROM Drive)和光通 讯元件裡也都需要光学镜片。

现今光学镜片必须搭配日益小型化的 CCD、CMOS 等影像感测器,或光碟机,使得光学镜片的精密程度乃甚 高于传统的眼镜等光学器材。

光学元件分類方式从天文望远镜的大型镜头到光学讀取头裡的小型绕射光学元件,以及精度要求各有所不同的玻璃镜片或塑胶镜片、球面镜或非球面镜等,这些光学产品所需要的光学元件可谓琳琅满目,依其技术原理分類,大致上可分做(1)几何光学元件、 (2)绕射光学元件,和(3)干涉光学元件,以及(4)偏振光学元件等。以材质之不同大约可分为玻璃与塑胶兩類。

而若再以镜片的形狀分類则又可为球面镜与非球面镜,所以光学元件有几种不同的分類,几种分類的方式如下,这几种分類方式彼此并不互斥。

  1. PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR
    PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR

    快速固化导电/銀胶/低模量

    Fast cure/Electrically/Low modulus

  2. PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR
    PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR

    絕緣胶,二階段烘烤与玻璃、塑料及陶瓷及金属有良好接着

    Non-conductive. B-stage type Good adhesion with Glass/PC/LCP/Cermaic/Metal

  3. PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR
    PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR

    快速固化&导电銀胶

    Snap cure electrically conductive & Thermal Conductive

  4. PROTAVIC PVIC ACE 44071LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1003Y=10G-SYR
    PROTAVIC PVIC ACE 44071LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1003Y=10G-SYR

    低温固化&导电銀胶

    Electrically conductive and Low Temp.

  5. PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR
    PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR

    低温固化&导电銀胶

    Electrically conductive and Low Temp.

  6. PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR
    PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR

    絕緣胶, 与玻璃、塑料及陶瓷有良好接着

    Non-conductive. Good adhesion with Glass/PC/LCP/Cermaic

  7. PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR
    PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR

    絕緣胶,具紅外线阻絕,与塑料及陶瓷有良好接着

    Non-conductive. IR cut. Good adhesion with PC/LCP/Cermaic

  8. PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR
    PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR

    低温固化絕緣胶

    Non-conductive. Low temperature cured. Good adhesion for die bonding and horder bond

  9. PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR
    PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR

    低温固化&导电銀胶

    Electrically conductive and Low Temp. cure

  10. DOW CORNING DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR
    DOW CORNING DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR

    导电銀胶,具导热接着,对鎳/铝/压层板有良好接着能力

    Electrically & Thermal Conductive, High thermal conductive/ good adhesion with Ni and Al.

  11. DOW CORNING DA 6633 PRINTABLE MICROELECTRONIC ADHESIVE WHITE,170G-CRT
    DOW CORNING DA 6633 PRINTABLE MICROELECTRONIC ADHESIVE WHITE,170G-CRT

    导热絕緣胶,为BOC 胶材,不含溶剂,使用网印制程,取代一般B-Stage 胶材

    Insulation, Solvent free/ A-stage, screen printing process

  12. DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR
    DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR

    絕緣接着,具高接着強度,可耐迴銲制程制程接着胶。

    Insulation Adhesive, High temperature Lid seal and heat sink attach adhesive designed for Pb-free reflow conditions such as 260C.

  13. DOW CORNING Q1-9239 CHARCOAL GRAY,1KG-CAN
    DOW CORNING Q1-9239 CHARCOAL GRAY,1KG-CAN

    黑色,高黏度具搖變性保护胶

    Black adhesive/ High viscosity.

  14. DOW CORNING R 6102 HIPEC BLACK,453G-CAN
    DOW CORNING R 6102 HIPEC BLACK,453G-CAN

    黑色晶片保护胶,低黏度热固型,具良好的热穩定性

    Black, IC Coating, Encapsulant/ Low viscosity/ High thermostability

  15. PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR
    PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR

    导电銀胶

    Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles

  16. DOWSIL™ 7920 BLACK SDA,10G-SYR
    DOWSIL™ 7920 BLACK SDA,10G-SYR

    导热絕緣胶,低应力胶材,适用于 MEMS产品应用。

    Insulation,Low modulus and CTE.

  17. PROTAVIC 668-3S SILVER WHITE,33G-SYR
    PROTAVIC 668-3S SILVER WHITE,33G-SYR

    低功率&导电銀胶

    Low thermal conductive and long work life

  18. PROTAVIC PVIC ACH 35001LV SILVER WHITE,4CC=16G-SYR
    PROTAVIC PVIC ACH 35001LV SILVER WHITE,4CC=16G-SYR

    高功率&导电銀胶

    High thermal conductive / High adhesion strength on hot temperature

  19. PROTAVIC PVIC ACH 35006 ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=40G-SYR
    PROTAVIC PVIC ACH 35006 ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=40G-SYR

    繞結銀胶

    Sintering silver non-solvent,good workability

  20. PROTAVIC PVIC ANH 34056 DIE ATTACH_NON-CONDUCTIVITY CLEAR,5CC=5G-SYR
    PROTAVIC PVIC ANH 34056 DIE ATTACH_NON-CONDUCTIVITY CLEAR,5CC=5G-SYR

    絕緣胶高Tg,高接着張度

    Non-conductive. High Tg/ Good adhesion

  21. PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR
    PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR

    絕緣胶/高接着力/具导热效果

    Non-conductive. Good adhesion and thermal conducitvy 1W/Mk

  22. PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR
    PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR

    低功率&导电銀胶

    Low thermal conductive and long work life

  23. DOWSIL™ Q2-1345 DILUENT,340G-CAN
    DOWSIL™ Q2-1345 DILUENT,340G-CAN

    高纯度,是非揮发性矽胶的液体溶剂,可在室温下完成蒸发,不会有殘留物,不破坏臭氧层,使用中不会产生煙霧,无味。高纯度,可在室温下可完全蒸发

    High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents

  24. DOW CORNING OE 8001 DIE ATTACH CLEAR,5G-SYR
    DOW CORNING OE 8001 DIE ATTACH CLEAR,5G-SYR

    絕緣胶,耐黃變

    Insulation. Non-yellowing

  25. DOW CORNING OE 8011 OPTICAL DIE ATTACH LOW 9PL TRANSLUCENT,10G-SYR
    DOW CORNING OE 8011 OPTICAL DIE ATTACH LOW 9PL TRANSLUCENT,10G-SYR

    耐黃變,低分子揮发,高接着強度,热穩定性高

    Non-yellowing / low outgassing/ Good adhesion/ High thermostability

  26. DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR
    DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR

    具导热特性,热穩定性高

    Thermal conductive/ High thermostability

  27. DOW CORNING OE 6551 A-B OPTICAL ENCAPSULANT
    DOW CORNING OE 6551 A-B OPTICAL ENCAPSULANT

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  28. DOW CORNING OE 6630 A-B TRANSPARENT SILICONE RESIN
    DOW CORNING OE 6630 A-B TRANSPARENT SILICONE RESIN

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  29. DOW CORNING OE 6631 A-B SILICONE OPTICAL RESIN CLEAR K
    DOW CORNING OE 6631 A-B SILICONE OPTICAL RESIN CLEAR K

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  30. DOW CORNING OE 6635 A-B TRANSPARENT SILICONE RESIN
    DOW CORNING OE 6635 A-B TRANSPARENT SILICONE RESIN

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  31. DOW CORNING OE 6636 A-B SILICONE OPTICAL MATERIAL CLEAR K
    DOW CORNING OE 6636 A-B SILICONE OPTICAL MATERIAL CLEAR K

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  32. DOW CORNING OE 6650 A-B RESIN CLEAR
    DOW CORNING OE 6650 A-B RESIN CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  33. DOW CORNING OE 6652 A-B OPTICAL ENCAPSULANT CLEAR
    DOW CORNING OE 6652 A-B OPTICAL ENCAPSULANT CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  34. DOW CORNING OE 6662 A-B OPTICAL ENCAPSULANT
    DOW CORNING OE 6662 A-B OPTICAL ENCAPSULANT

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  35. DOW CORNING OE 7640 A-B OPTICAL ENCAPSULANT D-45 CLEAR
    DOW CORNING OE 7640 A-B OPTICAL ENCAPSULANT D-45 CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  36. DOW CORNING OE 7662 A-B OPTICAL ENCAPSULANT CLEAR
    DOW CORNING OE 7662 A-B OPTICAL ENCAPSULANT CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  37. DOW CORNING OE 7840 A-B OPTICAL ENCAPSULANT CLEAR,1650G-KIT 1:10
    DOW CORNING OE 7840 A-B OPTICAL ENCAPSULANT CLEAR,1650G-KIT 1:10

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  38. DOW CORNING OE 7841 A-B OPTICAL ENCAPSULANT COLOURLESS
    DOW CORNING OE 7841 A-B OPTICAL ENCAPSULANT COLOURLESS

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  39. DOW CORNING SR 7010 A-B POT RESIN CLEAR,2KG-KIT 1:1
    DOW CORNING SR 7010 A-B POT RESIN CLEAR,2KG-KIT 1:1

    双液热固光学级矽胶

    Two part heat curable optical grade silicone resin

  40. DOW CORNING WR 3100 A-B DIE EDGE COAT WHITE,110G-KIT 1:10
    DOW CORNING WR 3100 A-B DIE EDGE COAT WHITE,110G-KIT 1:10

    双液热固型高反射矽樹脂

    Two part silicone heat curable high reflective resin

  41. DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT
    DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT

    氟素矽胶. 具耐油性与抗腐蝕

    fluoropolymer type, Resistance to oil and corrosion resistance

  42. DOWSIL™ X3-6211 CLEAR,175ML-CRT
    DOWSIL™ X3-6211 CLEAR,175ML-CRT

    可UV 固化型矽凝胶

    UV curable silicone gel

  43. SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
    SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

    对於CSP、BGA晶片做底填时,可以緩衝錫球接点的膨胀收縮应力,並可以緩衝摔落測試时的反作用力传导的剪力。

    For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.

  44. SIL-MORE EPO-SIL 1847 A IR CUT PLASTIC PACKAGING MATERIAL GREEN,4KG-CAN
    SIL-MORE EPO-SIL 1847 A IR CUT PLASTIC PACKAGING MATERIAL GREEN,4KG-CAN

    本产品为含有紅外线遮蔽物质的環氧樹脂封裝胶材,擁有使用时间長,封裝后具高可見光穿透度和优異的不可見光遮蔽性质。

    This product is an epoxy resin material containing near infrared cutting material, which has long pot life and excellent invisible light shielding properties.

  45. DOW CORNING OE 6351 A-B SILICONE ENCAPSULANT CLEAR
    DOW CORNING OE 6351 A-B SILICONE ENCAPSULANT CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  46. DOW CORNING OE 6370HF A-B COMPRESSION MOLD FAST CURE 6000CPS
    DOW CORNING OE 6370HF A-B COMPRESSION MOLD FAST CURE 6000CPS

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  47. DOW CORNING OE 6370M A-B DISPENSOR 3500CPS CLEAR
    DOW CORNING OE 6370M A-B DISPENSOR 3500CPS CLEAR

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  48. DOW CORNING OE 7340 A-B OPTICAL ENCAPSULANT PALE YELLOW
    DOW CORNING OE 7340 A-B OPTICAL ENCAPSULANT PALE YELLOW

    双液热固光学级矽胶

    Two part heat curable optical grade silicone

  49. DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1
    DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1

    无溶剂的IC晶片保护胶,具良好光学特性与耐冷热冲击特性

    -混合比:1:1, 2:1, 10:1,

    -混合后黏度:4900-5800 m.Pas

    Optical properties.

    Mixing Ratio:1:1, 2:1, 10:1

    Mixed iscosity:4900-5800 m.Pas

  50. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    錫球保护材料, 取代Under Fill

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

  51. YINCAE SMT 158
    YINCAE SMT 158

    奈米级底部填充

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  52. YINCAE SMT 256 EP/SMT 138 EP
    YINCAE SMT 256 EP/SMT 138 EP

    Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

  53. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    高导热导电銀胶

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process

  54. DOW CORNING WR 3001 A-B DIE EDGE COAT WHITE,60G-KIT 1:1
    DOW CORNING WR 3001 A-B DIE EDGE COAT WHITE,60G-KIT 1:1

    双液热固型高反射弹性矽胶

    Two part silicone heat curable high reflective elastomer

  55. SIL-MORE AD 711 WHITE,100G-CAN
    SIL-MORE AD 711 WHITE,100G-CAN

    混合后彽黏度灌注/电器性质良好/无溶剂(100% solid content)/室温硬化(升温可加速反应)/灌注后发泡,体積膨胀約1.5倍

    Low initial viscosity after mixing solvent-free casting resin)/Good electrical characteristics/Solvent-free(100% solid content)/The reaction of the mixtures is started in room temperatures(The reaction is accelerated during higher temperatures)/The volume of the resin expanded about 150% after casting

  56. SIL-MORE AO 131 WHITE,100G-CAN
    SIL-MORE AO 131 WHITE,100G-CAN

    抗沉降剂

    Anti-Sendimentation Agents

  57. SIL-MORE SIL-BC 450 BLUE RAY 450NM CUT YELLOW,10G-CAN
    SIL-MORE SIL-BC 450 BLUE RAY 450NM CUT YELLOW,10G-CAN

    金属氧化物擴散粉

    Diffusion Brightening Agents

  58. SIL-MORE SIL-CB 909
    SIL-MORE SIL-CB 909

    增白色剂

    Blackout

  59. DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,30G-SYR
    DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,30G-SYR

    粘合性佳,热稳定性高,离子杂质含量低,适用于点胶

    Excellent adhesion/High thermostability/Low levels of ionic impurities/Suitable for dispensing

  60. DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,500G-KIT 10:1
    DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,500G-KIT 10:1

    透明双剂型密封剂,粘合性佳,热稳定性高
    Two part silicone encapsulants/Excellent adhesion/High thermostability

  61. DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,10G-SYR
    DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,10G-SYR

    粘合性佳,热稳定性高,离子杂质含量低,适用于点胶

    Excellent adhesion/High thermostability/Low levels of ionic impurities/Suitable for dispensing

  62. DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,680G-KIT 2:1
    DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,680G-KIT 2:1

    透明双剂型密封剂,粘合性佳,热稳定性高
    Two part silicone encapsulants/Excellent adhesion/High thermostability