环氧树脂 产品目录

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筛选产品

  1. SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
    SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

    对於CSP、BGA晶片做底填时,可以緩衝錫球接点的膨胀收縮应力,並可以緩衝摔落測試时的反作用力传导的剪力。

    For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.

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