灌注密封 产品目录

7

設置降序順序

筛选产品

  1. SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR
    SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR

    本产品是針对电子制品所開发,覆晶封裝用的單液型環氧樹脂 为无溶剂型單液環氧樹脂,完全不含揮发性物质,不会释放毒素。在温度80oC时具有良好的滲透性。固化后具有良好的低收縮性。固化后对於氣态和液态的水分都具有良好的抵抗能力。符合EC RoHS法規規範。符合氯<900ppm,溴<900ppm,氯+溴<1500ppm

    This product is developed for electronic products,flip-chip package with a one-part epoxy solvent-free single liquid epoxy resin, completely free of volatile substances,it will not release toxins.

    It has good permeability when the temperature is 80oC. After curing has excellent low shrinkage. After curing for gaseous and liquid water has a good resistance. Compliance with EC RoHS norms and regulations. Compliance with chlorine <900ppm,bromine <900ppm, chlorine + bromine <1500ppm

  2. SIL-MORE HU 101PU CURING AGENT CLEAR,5KG-CAN 1:1
    SIL-MORE HU 101PU CURING AGENT CLEAR,5KG-CAN 1:1

    具有耐阳光紫外线,室外长时间曝晒不变黄之优点

    Flexible type for 3D doming ,potting with excellent UV resistance

  3. SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN
    SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN

    低黏度、透光性佳、绝缘性良好、耐候性高

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

  4. SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR
    SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR

    本产品是針对电子制品所開发,覆晶封裝用的單液型環氧樹脂。具有良好的操作性,可广泛应用在电子产品的灌注,填缝和封裝。

    This product is developed for electronic products, flip-chip package with a single-part epoxy resin. Has good operability, can be widely used in electronic products perfusion, caulking and packaging.

  5. SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1
    SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1

    低黏度、透光性佳、绝缘性良好、耐候性高

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

7

設置降序順序