灌注密封
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DOWSIL™ CN 8760G B POTTING BLACK,25KG-PAIL导热／低黏度
Thermally／Conductive&Low viscosity
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DOWSIL™ CN 8760G A POTTING WHITE,25KG-PAIL導熱／低黏度
Thermally／Conductive&Low viscosity
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SYLGARD 184 A-B ELASTOMER KIT,19.9KG-KIT 10:1透明,室温固化,硬度較高
Transparent encapsulant,room temperature cure
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DOWSIL™ CN-7326 A-B Potting Agen KIT , A:12KG/B:2kg, 6:1双剂型有机硅导热灌注封装胶，适用于车用电子、电源(电池)模块和电控单元产品
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PU-SIL PU-SIL 303 A 2K NON-SOLVENT CASTING RESIN LIGHT YELLOW LIQUID,15KG-PAIL混合後彽黏度灌注／電器性質良好／無溶劑（100% solid content）室溫硬化 (升溫可加速反應)／耐溫範圍：-40~200℃
Low initial viscosity after mixing solvent-free casting resin／Good electrical characteristics／Solvent-free（100% solid content）／The reaction of the mixtures is started in room temperatures. (Thereaction is accelerated during higher temperatures)／Temp. Resistance:-40~200℃
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SIL-MORE PU-SIL 303 B NON-SOLVENT CASTING RESIN LIGHT YELLOW,1KG-CAN 100:70耐高壓環境測試
High pressure environment test
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FONG YONG H536 EPOXY CURING AGENT LIGHT AMBER,300G-CAN 100:30耐高压,耐温150℃
high voltage resistance,high temperature resistance up to 150℃
