SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR 产品目录

本产品是針对电子制品所開发,覆晶封裝用的單液型環氧樹脂 为无溶剂型單液環氧樹脂,完全不含揮发性物质,不会释放毒素。在温度80oC时具有良好的滲透性。固化后具有良好的低收縮性。固化后对於氣态和液态的水分都具有良好的抵抗能力。符合EC RoHS法規規範。符合氯<900ppm,溴<900ppm,氯+溴<1500ppm

This product is developed for electronic products,flip-chip package with a one-part epoxy solvent-free single liquid epoxy resin, completely free of volatile substances,it will not release toxins.

It has good permeability when the temperature is 80oC. After curing has excellent low shrinkage. After curing for gaseous and liquid water has a good resistance. Compliance with EC RoHS norms and regulations. Compliance with chlorine <900ppm,bromine <900ppm, chlorine + bromine <1500ppm

產品資訊
特性: 覆晶封装用
市场应用: 消费性产品
市场应用2: 一般行业(通用产业)
颜色: 黑色
认证:
品牌: SIL-MORE

外观颜色:黑色液狀


黏度(mPa.s):5,200


儲存條件:-40oC~-5oC


硬度(Shore):90D


包装:30ML


应用范围:BGA、CSP覆晶封装用環氧樹脂


固化条件:20Mins@150℃


混合比:单液型


体积电阻系数(ohm*cm):4.5*1015


密度(g/cm3):1.6


线性热膨系数:32


工作时间(@25℃/HR):3-5天/Days/72~120hrs


玻璃转化温度(Tg):93℃