半導體(Semiconductor)

三種導電性不同的材料比較,金屬的價電帶與導電帶之間沒有距離,因此電子(紅色實心圓圈)可以自由移動。絕緣體的能隙寬度最大,電子難以從價電帶躍遷至導電帶。半導體的能隙在兩者之間,電子較容易躍遷至導電帶中。

半導體(Semiconductor)指一種導電性可受控制,範圍可從絕緣體至導體之間的材料。無論從科技或是經濟發展的角度來看,半導體的重要性都是非常巨大的。今日大部分的電子產品,如:計算機、行動電話或是數位錄音機當中的核心單元都和半導體有著極為密切的關連。常見的半導體材料有矽、鍺、砷化鎵等,而矽更是各種半導體材料中,在商業應用上最具有影響力的一種。

材料的導電性是由導帶中含有的電子數量決定。當電子從價帶獲得能量而跳躍至導電帶時,電子就可以在帶間任意移動而導電。一般常見的金屬材料其導電帶與價電帶之間的能隙非常小,在室溫下電子很容易獲得能量而跳躍至導電帶而導電,而絕緣材料則因為能隙很大(通常大於9電子伏特),電子很難跳躍至導電帶,所以無法導電。

一般半導體材料的能隙約為1至3電子伏特,介於導體和絕緣體之間。因此只要給予適當條件的能量激發,或是改變其能隙之間距,此材料就能導電。

半導體通過電子傳導或電洞傳導的方式傳輸電流。電子傳導的方式與銅線中電流的流動類似,即在電場作用下高度電離的原子將多餘的電子向著負離子化程度比較低的方向傳遞。電洞導電則是指在正離子化的材料中,原子核外由於電子缺失形成的「電洞」,在電場作用下,電洞被少數的電子補入而造成電洞移動所形成的電流(一般稱為正電流)。

材料中載子(carrier)的數量對半導體的導電特性極為重要。這可以通過在半導體中有選擇的加入其他「雜質」(IIIA、VA族元素)來控制。如果我們在純矽中摻雜(doping)少許的砷或磷(最外層有5個電子),就會多出1個自由電子,這樣就形成N型半導體;如果我們在純矽中摻入少許的硼(最外層有3個電子),就反而少了1個電子,而形成一個電洞(hole),這樣就形成P型半導體(少了1個帶負電荷的原子,可視為多了1個正電荷)。

近十年來,半導體的發展由早期的電腦產業延伸到智慧型裝置與物聯網的應用下持續發酵,更在近年來更帶動車聯網與AI科技發展, 並逐漸成為下一個發展領域重點,在技術上屢有重大突破。因此IC本身的功能愈益多元複雜,相對IC封裝的可靠度要求也更加嚴苛。

喬越實業有限公司在既有的支架型(Lead Frame Base)與基板型(Substrate Base)封裝已經有完善的封裝膠材整合方案,現今為滿足先進封裝與高階產品的技術應用,其產品線包括DOWSIL、XIAMETER、PROTAVIC、YINCAE、PANAXEM、AOS等國際知名膠材供應商。在產品應用上包含:固晶膠Die Attach(導電與絕緣)/晶片保護膠Die Coating、Encapsulant(絕緣)/導熱封裝膠Thermal Interface Material (導電與絕緣)/金屬蓋接著Lid Seal、Attach (導電與絕緣)/暫接著保護膠Wafer Temporary Bonding(絕緣)/底部填充膠Under Fill、Epoxy Flux(絕緣)/燒結銀膠與新型態錫膏New Sintering Silver glue and Solder Paste(導電)。

喬越實業有限公司為專業膠材代理商,不僅考量半導體產業的前端製程封裝膠材應用,更為了協助客戶可進行快速分析異常,同時提供DYNALOY除膠劑及除膠液(Remover/Stripper),可清除Cured Epoxy, Silicone, PU, Acrylic等,以利客戶精準分析。在全球產業佈局上,更與策略伙伴KRAYDEN進行海外市場合作,可以為客戶及終端客戶提供更無縫接軌的全球銷售網絡服務。

在充滿挑戰與封裝技術日新月異的半導體領域,需要具有全方位膠材方案且能及時解決客戶膠材需求的供應商,喬越實業一直在製程中扮演關關鍵材料的的供應角色,提供封裝膠材解決方案與客戶共同開發新應用膠材,是半導體產業中最信賴的合作伙伴。

  1. PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR
    PROTAVIC PVIC HI-BOND A3 DIE ATTACH_CONDUCTIVITY SILVER WHITE,5CC=16.5G-SYR

    快速固化導電/銀膠/低模量

    Fast cure/Electrically/Low modulus

  2. PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR
    PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR

    絕緣膠,二階段烘烤與玻璃、塑料及陶瓷及金屬有良好接著

    Non-conductive. B-stage type Good adhesion with Glass/PC/LCP/Cermaic/Metal

  3. PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR
    PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR

    快速固化&導電銀膠

    Snap cure electrically conductive & Thermal Conductive

  4. PROTAVIC PVIC ACE 44071LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1003Y=10G-SYR
    PROTAVIC PVIC ACE 44071LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,MUS 1003Y=10G-SYR

    低溫固化&導電銀膠

    Electrically conductive and Low Temp.

  5. PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR
    PROTAVIC PVIC ACE 44073LV LOW CURE ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD0503=10G-SYR

    低溫固化&導電銀膠

    Electrically conductive and Low Temp.

  6. PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR
    PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR

    絕緣膠, 與玻璃、塑料及陶瓷有良好接著

    Non-conductive. Good adhesion with Glass/PC/LCP/Cermaic

  7. PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR
    PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR

    絕緣膠,具紅外線阻絕,與塑料及陶瓷有良好接著

    Non-conductive. IR cut. Good adhesion with PC/LCP/Cermaic

  8. PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR
    PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR

    低溫固化絕緣膠

    Non-conductive. Low temperature cured. Good adhesion for die bonding and horder bond

  9. PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR
    PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR

    低溫固化&導電銀膠

    Electrically conductive and Low Temp. cure

  10. DOW CORNING DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR
    DOW CORNING DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR

    導電銀膠,具導熱接著,對鎳/鋁/壓層板有良好接著能力

    Electrically & Thermal Conductive, High thermal conductive/ good adhesion with Ni and Al.

  11. DOW CORNING DA 6633 PRINTABLE MICROELECTRONIC ADHESIVE WHITE,170G-CRT
    DOW CORNING DA 6633 PRINTABLE MICROELECTRONIC ADHESIVE WHITE,170G-CRT

    導熱絕緣膠,為BOC 膠材,不含溶劑,使用網印製程,取代一般B-Stage 膠材

    Insulation, Solvent free/ A-stage, screen printing process

  12. DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR
    DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR

    絕緣接著,具高接著強度,可耐迴銲製程製程接著膠。

    Insulation Adhesive, High temperature lidseal and heat sink attach adhesive designed for Pb-free reflow conditions such as 260C.

  13. DOW CORNING Q1-9239 CHARCOAL GRAY,1KG-CAN
    DOW CORNING Q1-9239 CHARCOAL GRAY,1KG-CAN

    黑色,高黏度具搖變性保護膠

    Black adhesive/ High viscosity.

  14. DOW CORNING R 6102 HIPEC BLACK,453G-CAN
    DOW CORNING R 6102 HIPEC BLACK,453G-CAN

    黑色晶片保護膠,低黏度熱固型,具良好的熱穩定性

    Black, IC Coating, Encapsulant/ Low viscosity/ High thermostability

  15. PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR
    PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR

    導電銀膠

    Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles

  16. DOWSIL™ 7920 BLACK SDA,10G-SYR
    DOWSIL™ 7920 BLACK SDA,10G-SYR

    導熱絕緣膠,低應力膠材,適用於 MEMS產品應用。

    Insulation,Low modulus and CTE.

  17. PROTAVIC 668-3S SILVER, 5CC=16.5G-SYR
    PROTAVIC 668-3S SILVER, 5CC=16.5G-SYR

    低功率&導電銀膠

    Low thermal conductive and long work life

  18. PROTAVIC PVIC ACH 35001LV SILVER WHITE,4CC=16G-SYR
    PROTAVIC PVIC ACH 35001LV SILVER WHITE,4CC=16G-SYR

    高功率&導電銀膠

    High thermal conductive / High adhesion strength on hot temperature

  19. PROTAVIC PVIC ACH 35006 ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=40G-SYR
    PROTAVIC PVIC ACH 35006 ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=40G-SYR

    繞結銀膠

    Sintering silver non-solvent,good workability

  20. PROTAVIC PVIC ANH 34056 DIE ATTACH_NON-CONDUCTIVITY CLEAR,5CC=5G-SYR
    PROTAVIC PVIC ANH 34056 DIE ATTACH_NON-CONDUCTIVITY CLEAR,5CC=5G-SYR

    絕緣膠高Tg,高接著張度

    Non-conductive. High Tg/ Good adhesion

  21. PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR
    PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR

    絕緣膠/高接著力/具導熱效果

    Non-conductive. Good adhesion and thermal conducitvy 1W/Mk

  22. PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR
    PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR

    低功率&導電銀膠

    Low thermal conductive and long work life

  23. DOWSIL™ Q2-1345 DILUENT,340G-CAN
    DOWSIL™ Q2-1345 DILUENT,340G-CAN

    高純度,是非揮發性矽膠的液體溶劑,可在室溫下完成蒸發,不會有殘留物,不破壞臭氧層,使用中不會產生煙霧,無味。高純度,可在室溫下可完全蒸發

    High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents

  24. DOW CORNING OE 8001 DIE ATTACH CLEAR,5G-SYR
    DOW CORNING OE 8001 DIE ATTACH CLEAR,5G-SYR

    絕緣膠,耐黃變

    Insulation. Non-yellowing

  25. DOW CORNING OE 8011 OPTICAL DIE ATTACH LOW 9PL TRANSLUCENT,10G-SYR
    DOW CORNING OE 8011 OPTICAL DIE ATTACH LOW 9PL TRANSLUCENT,10G-SYR

    耐黃變,低分子揮發,高接著強度,熱穩定性高

    Non-yellowing / low outgassing/ Good adhesion/ High thermostability

  26. DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR
    DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR

    具導熱特性,熱穩定性高

    Thermal conductive/ High thermostability

  27. DOW CORNING OE 6551 A-B OPTICAL ENCAPSULANT
    DOW CORNING OE 6551 A-B OPTICAL ENCAPSULANT

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  28. DOW CORNING OE 6630 A-B TRANSPARENT SILICONE RESIN
    DOW CORNING OE 6630 A-B TRANSPARENT SILICONE RESIN

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone resin

  29. DOW CORNING OE 6631 A-B SILICONE OPTICAL RESIN CLEAR K
    DOW CORNING OE 6631 A-B SILICONE OPTICAL RESIN CLEAR K

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  30. DOW CORNING OE 6635 A-B TRANSPARENT SILICONE RESIN
    DOW CORNING OE 6635 A-B TRANSPARENT SILICONE RESIN

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  31. DOW CORNING OE 6636 A-B SILICONE OPTICAL MATERIAL CLEAR K
    DOW CORNING OE 6636 A-B SILICONE OPTICAL MATERIAL CLEAR K

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  32. DOW CORNING OE 6650 A-B RESIN CLEAR
    DOW CORNING OE 6650 A-B RESIN CLEAR

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone resin

  33. DOW CORNING OE 6652 A-B OPTICAL ENCAPSULANT CLEAR
    DOW CORNING OE 6652 A-B OPTICAL ENCAPSULANT CLEAR

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone resin

  34. DOW CORNING OE 6662 A-B OPTICAL ENCAPSULANT
    DOW CORNING OE 6662 A-B OPTICAL ENCAPSULANT

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone resin

  35. DOW CORNING OE 7640 A-B OPTICAL ENCAPSULANT D-45 CLEAR
    DOW CORNING OE 7640 A-B OPTICAL ENCAPSULANT D-45 CLEAR

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone resin

  36. DOW CORNING OE 7662 A-B OPTICAL ENCAPSULANT CLEAR
    DOW CORNING OE 7662 A-B OPTICAL ENCAPSULANT CLEAR

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone resin

  37. DOW CORNING OE 7840 A-B OPTICAL ENCAPSULANT CLEAR,1650G-KIT 1:10
    DOW CORNING OE 7840 A-B OPTICAL ENCAPSULANT CLEAR,1650G-KIT 1:10

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  38. DOW CORNING OE 7841 A-B OPTICAL ENCAPSULANT COLOURLESS
    DOW CORNING OE 7841 A-B OPTICAL ENCAPSULANT COLOURLESS

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  39. DOW CORNING SR 7010 A-B POT RESIN CLEAR,2KG-KIT 1:1
    DOW CORNING SR 7010 A-B POT RESIN CLEAR,2KG-KIT 1:1

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone resin

  40. DOW CORNING WR 3100 A-B DIE EDGE COAT WHITE,110G-KIT 1:10
    DOW CORNING WR 3100 A-B DIE EDGE COAT WHITE,110G-KIT 1:10

    雙液熱固型高反射矽樹脂

    Two part silicone heat curable high reflective resin

  41. DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT
    DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT

    氟素矽膠. 具耐油性與抗腐蝕

    fluoropolymer type, Resistance to oil and corrosion resistance

  42. DOWSIL™ X3-6211 CLEAR,175ML-CRT
    DOWSIL™ X3-6211 CLEAR,175ML-CRT

    可UV 固化型矽凝膠

    UV curable silicone gel

  43. DOW CORNING OE 6351 A-B SILICONE ENCAPSULANT CLEAR
    DOW CORNING OE 6351 A-B SILICONE ENCAPSULANT CLEAR

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  44. DOW CORNING OE 6370HF A-B COMPRESSION MOLD FAST CURE 6000CPS
    DOW CORNING OE 6370HF A-B COMPRESSION MOLD FAST CURE 6000CPS

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  45. DOW CORNING OE 6370M A-B DISPENSOR 3500CPS CLEAR
    DOW CORNING OE 6370M A-B DISPENSOR 3500CPS CLEAR

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  46. DOW CORNING OE 7340 A-B OPTICAL ENCAPSULANT PALE YELLOW
    DOW CORNING OE 7340 A-B OPTICAL ENCAPSULANT PALE YELLOW

    雙液熱固光學級矽膠

    Two part heat curable optical grade silicone

  47. DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1
    DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1

    無溶劑的IC晶片保護膠,具良好光學特性與耐冷熱衝擊特性

    -混合比:1:1, 2:1, 10:1,

    -混合後黏度:4900-5800 m.Pas

    Optical properties.

    Mixing Ratio:1:1, 2:1, 10:1

    Mixed iscosity:4900-5800 m.Pas

  48. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    錫球保護材料, 取代Under Fill

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

  49. YINCAE SMT 158
    YINCAE SMT 158

    奈米級底部填充

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  50. YINCAE SMT 256 EP/SMT 138 EP
    YINCAE SMT 256 EP/SMT 138 EP

    Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

  51. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    高導熱導電銀膠

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process

  52. DOW CORNING WR 3001 A-B DIE EDGE COAT WHITE,60G-KIT 1:1
    DOW CORNING WR 3001 A-B DIE EDGE COAT WHITE,60G-KIT 1:1

    雙液熱固型高反射彈性矽膠

    Two part silicone heat curable high reflective elastomer