Epoxy Base Product Catalog

10 Items

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  1. SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR
    SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR

    This product is developed for electronic products, flip-chip package with a single-part epoxy resin. Has good operability, can be widely used in electronic products perfusion, caulking and packaging.

  2. SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR
    SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR

    This product is developed for electronic products,flip-chip package with a one-part epoxy solvent-free single liquid epoxy resin, completely free of volatile substances,it will not release toxins.

    It has good permeability when the temperature is 80oC. After curing has excellent low shrinkage. After curing for gaseous and liquid water has a good resistance. Compliance with EC RoHS norms and regulations. Compliance with chlorine <900ppm,bromine <900ppm, chlorine + bromine <1500ppm

  3. SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
    SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

    For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.

  4. SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN
    SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

  5. SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1
    SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

10 Items

per page
Set Descending Direction