Potting & Encapsulant Product Catalog

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  1. SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
    SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

    For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.

  2. PU-SIL PU-SIL 303 A 2K NON-SOLVENT CASTING RESIN LIGHT YELLOW LIQUID,15KG-PAIL
    PU-SIL PU-SIL 303 A 2K NON-SOLVENT CASTING RESIN LIGHT YELLOW LIQUID,15KG-PAIL

    混合後彽黏度灌注/電器性質良好/無溶劑(100% solid content)室溫硬化 (升溫可加速反應)/耐溫範圍:-40~200℃

    Low initial viscosity after mixing solvent-free casting resin/Good electrical characteristics/Solvent-free(100% solid content)/The reaction of the mixtures is started in room temperatures. (Thereaction is accelerated during higher temperatures)/Temp. Resistance:-40~200℃

  3. SIL-MORE HU 101PU CURING AGENT CLEAR,5KG-CAN 1:1
    SIL-MORE HU 101PU CURING AGENT CLEAR,5KG-CAN 1:1

    Flexible type for 3D doming ,potting with excellent UV resistance

  4. SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1
    SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

  5. SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN
    SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

Items 1-10 of 23

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