灌注密封 產品目錄

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  1. SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
    SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

    對於CSP、BGA晶片做底填時,可以緩衝錫球接點的膨脹收縮應力,並可以緩衝摔落測試時的反作用力傳導的剪力。

    For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.

  2. PU-SIL PU-SIL 303 A 2K NON-SOLVENT CASTING RESIN LIGHT YELLOW LIQUID,15KG-PAIL
    PU-SIL PU-SIL 303 A 2K NON-SOLVENT CASTING RESIN LIGHT YELLOW LIQUID,15KG-PAIL

    混合後彽黏度灌注/電器性質良好/無溶劑(100% solid content)室溫硬化 (升溫可加速反應)/耐溫範圍:-40~200℃

    Low initial viscosity after mixing solvent-free casting resin/Good electrical characteristics/Solvent-free(100% solid content)/The reaction of the mixtures is started in room temperatures. (Thereaction is accelerated during higher temperatures)/Temp. Resistance:-40~200℃

  3. FONG YONG H536 EPOXY CURING AGENT LIGHT AMBER,300G-CAN 100:30
    FONG YONG H536 EPOXY CURING AGENT LIGHT AMBER,300G-CAN 100:30

    耐高壓,耐溫150℃

    high voltage resistance,high temperature resistance up to 150℃

  4. SIL-MORE HU 101PU CURING AGENT CLEAR,5KG-CAN 1:1
    SIL-MORE HU 101PU CURING AGENT CLEAR,5KG-CAN 1:1

    具有耐陽光紫外線,室外長時間曝曬不變黃之優點

    Flexible type for 3D doming ,potting with excellent UV resistance

  5. SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1
    SIL-MORE EU 220 B EPOXY CURING AGENT CLEAR,5KG-CAN 2:1

    低黏度、透光性佳、絶緣性良好、耐候性高

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

  6. SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN
    SIL-MORE EU 220 A EPOXY POTTING RESIN CLEAR,5KG-CAN

    低黏度、透光性佳、絶緣性良好、耐候性高

    Low viscosity, good to operate and translucent.Good Insulation and weathering resistance

項目1-1023

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