YINCAE SMT 158
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
| Characteristics： | Nano-level underfill |
|---|---|
| Market application： | Semiconductor |
| Market application 2： | Optical Components |
| Color： | White/Black |
| Compliance： | RoHS／HF |
| Brands： | YINCAE |
Appearance：White／Black
Viscosity(mPa.s )： 3,500~8,000
Storage condition：-40℃@6months
Package：10G／SYR,30G／SYR
Main application：Under Fill for BGA and flip chip
Application description：A device that requires a specification reliability such as BGA FLIPCHIP
Mix ratio：One Part
Curing condition：15minute@150°C,In-linecuring
Compliance：RoHS／HF
Shelf life：-40℃@6months
Specific Gravity(g／cm3)：1.8
Working Time(@25℃／hr)：>8
Transition Temperature(Tg)：149°C