YINCAE SMT 158
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
Characteristics: | Nano-level underfill |
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Market application: | Semiconductor |
Market application 2: | Optical Components |
Color: | White/Black |
Compliance: | RoHS/HF |
Brands: | YINCAE |

Appearance:White/Black
Viscosity(mPa.s ): 3,500~8,000
Storage condition:-40℃@6months
Package:10G/SYR,30G/SYR
Main application:Under Fill for BGA and flip chip
Application description:A device that requires a specification reliability such as BGA FLIPCHIP
Mix ratio:One Part
Curing condition:15minute@150°C,In-linecuring
Compliance:RoHS/HF
Shelf life:-40℃@6months
Specific Gravity(g/cm3):1.8
Working Time(@25℃/hr):>8
Transition Temperature(Tg):149°C