YINCAE SMT 256／BP256
Applied by Dipping, screen printing and dispensing
Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material
| Characteristics： | lead free application / Replace underfill material |
|---|---|
| Market application： | Semiconductor |
| Market application 2： | Optical Components |
| Color： | Transparent/Black |
| Compliance： | RoHS／HF |
| Brands： | YINCAE |
Transparent ／Black
Viscosity(mPa.s )： 5,000~20,000
Storage condition：-40℃@6months
Package：10G／SYR,30G／SYR
Main application：Solder joint encapsulant
Application description：A device that requires a specification reliability such as BGA FLIPCHIP
Mix ratio：One Part
Curing condition：Reflowprocess(140℃~260℃)
Compliance：RoHS／HF
Shelf life：-40℃@6months
Specific Gravity(g／cm3)：1.05
Working Time(@25℃／hr)：>8
Transition Temperature(Tg)：98°C
Young Modulus(@25°C)：26.3Gpa