YINCAE SMT 256/BP256 Product Catalog

Applied by Dipping, screen printing and dispensing

Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

More Information
Characteristics: lead free application / Replace underfill material
Market application: Semiconductor
Market application 2: Optical Components
Color: Transparent/Black
Compliance: RoHS/HF
Brands: YINCAE

Transparent /Black


Viscosity(mPa.s ): 5,000~20,000


Storage condition:-40℃@6months


Package:10G/SYR,30G/SYR


Main application:Solder joint encapsulant


Application description:A device that requires a specification reliability such as BGA FLIPCHIP


Mix ratio:One Part


Curing condition:Reflowprocess(140℃~260℃)


Compliance:RoHS/HF


Shelf life:-40℃@6months


Specific Gravity(g/cm3):1.05


Working Time(@25℃/hr):>8


Transition Temperature(Tg):98°C


Young Modulus(@25°C):26.3Gpa