Epoxy Base Product Catalog

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  1. YINCAE SMT 158
    YINCAE SMT 158

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  2. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process

Items 1-10 of 17

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