Epoxy Base Product Catalog

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  1. PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR
    PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR

    Non-conductive. B-stage type Good adhesion with Glass/PC/LCP/Cermaic/Metal

  2. YINCAE SMT 158
    YINCAE SMT 158

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

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