Semiconductor Field Product Catalog

Insulation,Low modulus and CTE.

TIM 1, High thermal conductive 60W／mk with oven curing or reflow process

Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

Filler size <5nm

Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

Applied by Dipping, screen printing and dispensing

Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application ／ Replace underfill material

Optical properties.

Mixing Ratio:1:1, 2:1, 10:1

Mixed iscosity:4900-5800 m.Pas

UV curable silicone gel

fluoropolymer type, Resistance to oil and corrosion resistance

High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents

Low thermal conductive and long work life