Semiconductor Field
- YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
TIM 1, High thermal conductive 60W/mk with oven curing or reflow process
- YINCAE SMT 256 EP/SMT 138 EP
Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.
- YINCAE SMT 158
Filler size <5nm
Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.
- YINCAE SMT 256/BP256
Applied by Dipping, screen printing and dispensing
Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material
- DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1
Optical properties.
Mixing Ratio:1:1, 2:1, 10:1
Mixed iscosity:4900-5800 m.Pas
- DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT
fluoropolymer type, Resistance to oil and corrosion resistance
- DOWSIL™ Q2-1345 DILUENT,340G-CAN
High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents
- PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR
Low thermal conductive and long work life