Three different kinds of conductive materials compared to metal The price of electric tape There is no distance between the conductive bands, so the electrons (red solid circles) are free to move. InsulatorsThe width of the energy gap Max, electrons are hard to get fromValence Electric Belt JumpTo the conductive band. Semiconductor The energy gap in Both BetweenElectronic Easy Jump to Conductive band.

Semiconductor(SemiconductorRefers to a material that is electrically conductive and can be controlled from an insulator to a conductor. The importance of semiconductors is enormous, both in terms of technology and economic development. Today, most of the electronic products, such as: calculators,The core units in mobile phones or digital recorders are closely related to semiconductors. The common semiconductor materials are silicon, germanium, gallium arsenide, etc.and Silicon isOne of the most influential types of semiconductor materials in commercial applications.

The conductivity of the material isFrom the guide bandThe number of electrons contained in the decision. When electronicGet from the price bandWhen the energy jumps to the conductive band, the electrons can move freely between the bands and conduct electricity. The conductive bands of metal materials commonly usedand Valence electric tape Between The energy gap is verySmall, the electrons at room temperature can easily get energy and jump to the conductive band while conducting electricity, while insulating materials areThe gap is veryLarge (usually greater than 9 Electron volts), it is difficult to jump to the conductive band, so can not conduct electricity.

The energy gap of general semiconductor materials is about 1-3 Electron volts, between conductors and insulators. There fore, the material can be electrically conductive as long as the energy of the appropriate condition is stimulated or the distance between its energy gap is changed.

Semiconductors are transmitted through electronsor electric hole conductionWay to transmit the current. Electronic conduction is similar to the flow of current in copper wire, that is, the highly ionized atoms in the electric field transfer the excess electrons toward the lower anion level.Electric hole ConductionRefers to the positive ionizationIn the material, formed by an electron deficiency outside the nucleus.Electric Hole", inelectric field,Electric holes areFew ofElectrical hole movement caused by electronic fillingThe resulting current (usually called a positive current).

Carrier in material (Carrier) is of great importance to the conductive properties of semiconductors. This can be done by selectively adding other "impurities" in semiconductors (IIIA、VaFamily elements) to control. If we arePure silicondoped(Doping) A littleArsenic or phosphorus(The outermost5Electronics), there will be more1A free electron, which formsN-type semiconductor;Pure siliconAdding a little boron (the outermost layer has3electrons), but less.1Electrons, and formAn electric hole(Hole), thus formingPSemiconductor (less1A negatively charged atom that can be seen as more1Positive charge).

In the last decade, the development of semiconductors has been extended by the early computer industry to the application of intelligent device and IoT, and more in recent years, it has driven network and AI Technology development, and gradually become the next development area of focus, the technology has repeatedly made a major breakthrough. SoIcitself theFeatures are increasingly complex, relativelyIcThe reliability requirements for encapsulation are also more stringent.

SIl-more Industrial Co., Ltd. in the existing bracket type(Lead Frame Base)and Base plate type(Substrate Base)Packaging already has a comprehensive package of packaging solutions, today to meet advanced packaging and higher-order product technology applications, its product line includes DOWSIL,Xiameter,Protavic,Yincae,Panaxem,AOS and other international well-known plastic material suppliers. Include in product application:Solid Crystal AdhesiveDie Attach (Electrical conductivity and insulation)/Chip Protection AdhesiveDie Coating、Encapsulant (Insulation)/Thermal Conductive Packaging AdhesiveThermal Interface Material (Electrical conductivity and insulation)/Metal cover ThenLid Seal、Attach (Electrical conductivity and insulation)/Temporary protection AdhesiveWafer Temporary Bonding (Insulation)/Bottom filling glueUnder Fill、Epoxy Flux (Insulation)/Sintered silver glue and new type tin pasteNew sintering Silver Glue and solder Paste (Conductive)。

SIl-more Industrial Co., Ltd. Professional plastic material Agents, not only consider the front-end process of semiconductor industry Application of packaging plastic material, but also to assist customers in the rapid analysis of exceptions, while providing Dynaloyremoving glue and removing glueLiquid(Remover/stripper) to clearCured Epoxy, silicone, PU, acrylic And SIl-more Industrial Co., Ltd. as a professional agent, not only consider the semiconductor industry front-end packaging plastic applications, but also to assist customers can perform rapid analysis of anomalies, while providing DynaloyExcept the glue and the glue removal liquid (Remover/stripper) to clearCured Epoxy, silicone, PU, acrylicAnd so on, to facilitate accurate analysis of customers. In the global industrial layout, and strategic partner KraydenOverseas market cooperation can provide customers and end customers with a more seamless global sales network services.

In the challenging and packaging technology of the rapid changes in the semiconductor field, the need for a full range of plastic material solutions and timely solution to customer demand for plastic materials suppliers,SIl-more Industry has been in the process of playing a key material in the supply role, to provide packaging plastic solutions and customers to jointly develop new application of plastic materials, semiconductor industry is the most trusted partner.

  1. PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR
    PROTAVIC PVIC S-J(M-1)HV1 B-STAGE EPOXY ADHESIVE BLACK,EFD 1010=11G-SYR

    Non-conductive. B-stage type Good adhesion with Glass/PC/LCP/Cermaic/Metal

  2. PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR
    PROTAVIC HI-BOND SK-5D SILVER,5CC=16.8G-SYR

    Snap cure electrically conductive & Thermal Conductive

  3. PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR
    PROTAVIC PVIC ANE 24054A3 NON-ELECTRICALLY CONDUCTIVE BLACK,MUS1010Y=12G-SYR

    Non-conductive. Good adhesion with Glass/PC/LCP/Cermaic

  4. PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR
    PROTAVIC PVIC ANE 24054IR ADHESIVE GLUE BLACK,MUS1005=6GRAM-SYR

    Non-conductive. IR cut. Good adhesion with PC/LCP/Cermaic

  5. PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR
    PROTAVIC PVIC ANE 44062BH NONCONDUCTIVE BLACK,MUS1010Y=13G-SYR

    Non-conductive. Low temperature cured. Good adhesion for die bonding and horder bond

  6. PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR
    PROTAVIC HI-BOND CCD-1B SILVER WHITE,10CC=33G-SYR

    Electrically conductive and Low Temp. cure

  7. DOWSIL™ DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR
    DOWSIL™ DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR

    Electrically & Thermal Conductive, High thermal conductive/ good adhesion with Ni and Al.

  8. DOW CORNING DA 6633 PRINTABLE MICROELECTRONIC ADHESIVE WHITE,170G-CRT
    DOW CORNING DA 6633 PRINTABLE MICROELECTRONIC ADHESIVE WHITE,170G-CRT

    Insulation, Solvent free/ A-stage, screen printing process

  9. DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR
    DOW CORNING EA 6900 LID SEALANT BLACK,70G-SYR

    Insulation Adhesive, High temperature lidseal and heat sink attach adhesive designed for Pb-free reflow conditions such as 260C.

  10. DOW CORNING Q1-9239 CHARCOAL GRAY,1KG-CAN
    DOW CORNING Q1-9239 CHARCOAL GRAY,1KG-CAN

    Black adhesive/ High viscosity.

  11. DOW CORNING R 6102 HIPEC BLACK,453G-CAN
    DOW CORNING R 6102 HIPEC BLACK,453G-CAN

    Black, IC Coating, Encapsulant/ Low viscosity/ High thermostability

  12. PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR
    PROTAVIC PVIC X56-10HV ELECTRICALLY CONDUCTIVE SILVER WHITE,EFD1010=28G-SYR

    Electrically & Thermal Conductive ,Minimal resin bleed and low condensable volatiles

  13. DOWSIL™ 7920 BLACK SDA,10G-SYR
    DOWSIL™ 7920 BLACK SDA,10G-SYR

    Insulation,Low modulus and CTE.

  14. PROTAVIC 668-3S SILVER, 5CC=16.5G-SYR
    PROTAVIC 668-3S SILVER, 5CC=16.5G-SYR

    Low thermal conductive and long work life

  15. PROTAVIC PVIC ACH 35001LV SILVER WHITE,4CC=16G-SYR
    PROTAVIC PVIC ACH 35001LV SILVER WHITE,4CC=16G-SYR

    High thermal conductive / High adhesion strength on hot temperature

  16. PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR
    PROTAVIC PVIC ATH 34064 ELECTRICALLY NONCONDUCTIVE WHITE,MUS 1008=8CC-SYR

    Non-conductive. Good adhesion and thermal conducitvy 1W/Mk

  17. DOWSIL™ Q2-1345 DILUENT,340G-CAN
    DOWSIL™ Q2-1345 DILUENT,340G-CAN

    High purity liquid, Excellent wetting of device surfaces, Low VOC, Higher flash point than most commom organic solvents

  18. DOW CORNING OE 8011 OPTICAL DIE ATTACH LOW 9PL TRANSLUCENT,10G-SYR
    DOW CORNING OE 8011 OPTICAL DIE ATTACH LOW 9PL TRANSLUCENT,10G-SYR

    Non-yellowing / low outgassing/ Good adhesion/ High thermostability

  19. DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR
    DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR

    Thermal conductive/ High thermostability

  20. DOW CORNING OE 6551 A-B OPTICAL ENCAPSULANT
    DOW CORNING OE 6551 A-B OPTICAL ENCAPSULANT

    Two part heat curable optical grade silicone

  21. DOW CORNING OE 6630 A-B TRANSPARENT SILICONE RESIN
    DOW CORNING OE 6630 A-B TRANSPARENT SILICONE RESIN

    Two part heat curable optical grade silicone resin

  22. DOW CORNING OE 6631 A-B SILICONE OPTICAL RESIN CLEAR K
    DOW CORNING OE 6631 A-B SILICONE OPTICAL RESIN CLEAR K

    Two part heat curable optical grade silicone

  23. DOW CORNING OE 6635 A-B TRANSPARENT SILICONE RESIN
    DOW CORNING OE 6635 A-B TRANSPARENT SILICONE RESIN

    Two part heat curable optical grade silicone

  24. DOW CORNING OE 6636 A-B SILICONE OPTICAL MATERIAL CLEAR K
    DOW CORNING OE 6636 A-B SILICONE OPTICAL MATERIAL CLEAR K

    Two part heat curable optical grade silicone

  25. DOW CORNING OE 6650 A-B RESIN CLEAR
    DOW CORNING OE 6650 A-B RESIN CLEAR

    Two part heat curable optical grade silicone resin

  26. DOW CORNING OE 6652 A-B OPTICAL ENCAPSULANT CLEAR
    DOW CORNING OE 6652 A-B OPTICAL ENCAPSULANT CLEAR

    Two part heat curable optical grade silicone resin

  27. DOW CORNING OE 6662 A-B OPTICAL ENCAPSULANT
    DOW CORNING OE 6662 A-B OPTICAL ENCAPSULANT

    Two part heat curable optical grade silicone resin

  28. DOW CORNING OE 7640 A-B OPTICAL ENCAPSULANT D-45 CLEAR
    DOW CORNING OE 7640 A-B OPTICAL ENCAPSULANT D-45 CLEAR

    Two part heat curable optical grade silicone resin

  29. DOW CORNING OE 7662 A-B OPTICAL ENCAPSULANT CLEAR
    DOW CORNING OE 7662 A-B OPTICAL ENCAPSULANT CLEAR

    Two part heat curable optical grade silicone resin

  30. DOW CORNING OE 7841 A-B OPTICAL ENCAPSULANT COLOURLESS
    DOW CORNING OE 7841 A-B OPTICAL ENCAPSULANT COLOURLESS

    Two part heat curable optical grade silicone

  31. DOW CORNING SR 7010 A-B POT RESIN CLEAR,2KG-KIT 1:1
    DOW CORNING SR 7010 A-B POT RESIN CLEAR,2KG-KIT 1:1

    Two part heat curable optical grade silicone resin

  32. DOW CORNING WR 3100 A-B DIE EDGE COAT WHITE,110G-KIT 1:10
    DOW CORNING WR 3100 A-B DIE EDGE COAT WHITE,110G-KIT 1:10

    Two part silicone heat curable high reflective resin

  33. DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT
    DOWSIL™ 4-8022 FLUOROGEL SOLVENT RESISTANT GEL TRANSLUCENT WHITE,740G-CRT

    fluoropolymer type, Resistance to oil and corrosion resistance

  34. DOW CORNING OE 6351 A-B SILICONE ENCAPSULANT CLEAR
    DOW CORNING OE 6351 A-B SILICONE ENCAPSULANT CLEAR

    Two part heat curable optical grade silicone

  35. DOW CORNING OE 6370M A-B DISPENSOR 3500CPS CLEAR
    DOW CORNING OE 6370M A-B DISPENSOR 3500CPS CLEAR

    Two part heat curable optical grade silicone

  36. DOW CORNING OE 7340 A-B OPTICAL ENCAPSULANT PALE YELLOW
    DOW CORNING OE 7340 A-B OPTICAL ENCAPSULANT PALE YELLOW

    Two part heat curable optical grade silicone

  37. DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1
    DOWSIL™ Q1-4939 A-B SEMICONDUCTOR PROTECTIVE COATING KIT,900G-KIT 1:1

    Optical properties.

    Mixing Ratio:1:1, 2:1, 10:1

    Mixed iscosity:4900-5800 m.Pas

  38. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

  39. YINCAE SMT 158
    YINCAE SMT 158

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  40. YINCAE SMT 256 EP/SMT 138 EP
    YINCAE SMT 256 EP/SMT 138 EP

    Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

  41. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process

  42. DOW CORNING WR 3001 A-B DIE EDGE COAT WHITE,60G-KIT 1:1
    DOW CORNING WR 3001 A-B DIE EDGE COAT WHITE,60G-KIT 1:1

    Two part silicone heat curable high reflective elastomer

  43. DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,30G-SYR
    DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,30G-SYR

    Excellent adhesion/High thermostability/Low levels of ionic impurities/Suitable for dispensing

  44. DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,500G-KIT 10:1
    DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,500G-KIT 10:1

    Two part silicone encapsulants/Excellent adhesion/High thermostability

  45. DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,10G-SYR
    DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,10G-SYR

    Excellent adhesion/High thermostability/Low levels of ionic impurities/Suitable for dispensing

  46. DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,680G-KIT 2:1
    DOWSIL™ ME-4039 A-B DIE COATING FOR WIRE BOND PACKAGING CLEAR,680G-KIT 2:1

    Two part silicone encapsulants/Excellent adhesion/High thermostability