Epoxy Base Product Catalog

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  1. SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR
    SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR

    This product is developed for electronic products, flip-chip package with a single-part epoxy resin. Has good operability, can be widely used in electronic products perfusion, caulking and packaging.

  2. SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR
    SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR

    This product is developed for electronic products,flip-chip package with a one-part epoxy solvent-free single liquid epoxy resin, completely free of volatile substances,it will not release toxins.

    It has good permeability when the temperature is 80oC. After curing has excellent low shrinkage. After curing for gaseous and liquid water has a good resistance. Compliance with EC RoHS norms and regulations. Compliance with chlorine <900ppm,bromine <900ppm, chlorine + bromine <1500ppm

6 Items

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