DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,30G-SYR Product Catalog

Excellent adhesion/High thermostability/Low levels of ionic impurities/Suitable for dispensing

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Characteristics: General adhesive sealant, potting, Heat Resistant Sealant, Thermally Conductive Encapsulant, Thermal Conductivity&Adhesive Sealant
Market application: Semiconductor
Market application 2: General Industry
Color: Black
Compliance: No
Brands: DOWSIL™

Appearance:Black


Viscosity(mPa.s):20,000


Useful temperature ranges (℃):-10~-25


Durometer(Shore):A72


Package:30G/SYR


Application description:Die attach adhesive for microelectronics packaging


Curing condition :150°CX30mins


One or Two-part:One


Time for 20% Rise in Viscosity(@25℃/hr):>24


Specific Gravity (Cured)(g/ML):1.2


Unprimed Adhesion - Lap Shear (Al)(Mpa):6.9


Thixotropy:2.9


Shelf life:12Months