DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,10G-SYR
Excellent adhesion/High thermostability/Low levels of ionic impurities/Suitable for dispensing
Characteristics: | General adhesive sealant, potting, Heat Resistant Sealant, Thermally Conductive Encapsulant, Thermal Conductivity&Adhesive Sealant |
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Market application: | Semiconductor |
Market application 2: | General Industry |
Color: | Black |
Compliance: | No |
Brands: | DOWSIL™ |

Appearance:Black
Viscosity(mPa.s):20,000
Useful temperature ranges (℃):-10~-25
Durometer(Shore):A72
Package:10G/SYR
Application description:Die attach adhesive for microelectronics packaging
Curing condition :150°CX30mins
One or Two-part:One
Time for 20% Rise in Viscosity(@25℃/hr):>24
Specific Gravity (Cured)(g/ML):1.2
Unprimed Adhesion - Lap Shear (Al)(Mpa):6.9
Thixotropy:2.9
Shelf life:12Months