DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,10G-SYR
Excellent adhesion/High thermostability/Low levels of ionic impurities/Suitable for dispensing
| Characteristics： | General adhesive sealant, potting, Heat Resistant Sealant, Thermally Conductive Encapsulant, Thermal Conductivity&Adhesive Sealant |
|---|---|
| Market application： | Semiconductor |
| Market application 2： | General Industry |
| Color： | Black |
| Compliance： | No |
| Brands： | DOWSIL™ |
Appearance：Black
Viscosity(mPa.s)：20,000
Useful temperature ranges (℃)：-10~-25
Durometer(Shore)：A72
Package：10G／SYR
Application description：Die attach adhesive for microelectronics packaging
Curing condition ：150°CX30mins
One or Two-part：One
Time for 20% Rise in Viscosity(@25℃／hr)：>24
Specific Gravity (Cured)(g／ML)：1.2
Unprimed Adhesion - Lap Shear (Al)(Mpa)：6.9
Thixotropy：2.9
Shelf life：12Months