Epoxy Base - 導熱材料 Product Catalog

High adhesion strength、Heat cure

High adhesion strength、Heat cure

Does not slip phenomenon glue for increasing the substrate thickness

Low viscosity, Good Insulation

Fast cure structral bonding

This resin can be fast cured at low temperature, is able to reduce the working time and increase the efficiency at the same time. It has moderate viscosity, in the process of the curing process and will not be any vertical.

Good adhesive , Good oil resistance and good solvent resistance