SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR
This product is developed for electronic products, flip-chip package with a single-part epoxy resin. Has good operability, can be widely used in electronic products perfusion, caulking and packaging.
Characteristics: | Flip chip package |
---|---|
Market application: | Consumer Products |
Market application 2: | General Industry |
Color: | Black |
Compliance: | No |
Brands: | SIL-MORE |

Appearance:Black liquid
Viscosity(mPa.s ):20,000
Storage condition:-40oC~-5oC
Hardness(Shore):90D
Package:30ML
Application description:BGA,CSP flip-chip package coating epoxy resin
Curing condition:30minute@150℃or10minute@160℃
Mix ratio:One Part
Volume Resistivity(ohm*cm):4.5*1015
Specific Gravity(g/cm3):1.57
Coefficient of Linear Thermal Expansion ( PPM/ ℃ ) :28
Working Time(@25℃/hr):3Days/72hrs
Transition Temperature(Tg):124℃