SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR
This product is developed for electronic products, flip-chip package with a single-part epoxy resin. Has good operability, can be widely used in electronic products perfusion, caulking and packaging.
| Characteristics： | Flip chip package |
|---|---|
| Market application： | Consumer Products |
| Market application 2： | General Industry |
| Color： | Black |
| Compliance： | No |
| Brands： | SIL-MORE |
Appearance：Black liquid
Viscosity(mPa.s )：20,000
Storage condition：-40oC~-5oC
Hardness(Shore)：90D
Package：30ML
Application description：BGA,CSP flip-chip package coating epoxy resin
Curing condition：30minute@150℃or10minute@160℃
Mix ratio：One Part
Volume Resistivity(ohm*cm)：4.5*1015
Specific Gravity(g／cm3)：1.57
Coefficient of Linear Thermal Expansion ( PPM／ ℃ ) ：28
Working Time(@25℃／hr)：3Days／72hrs
Transition Temperature(Tg)：124℃