SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR
This product is developed for electronic products,flip-chip package with a one-part epoxy solvent-free single liquid epoxy resin, completely free of volatile substances,it will not release toxins.
It has good permeability when the temperature is 80oC. After curing has excellent low shrinkage. After curing for gaseous and liquid water has a good resistance. Compliance with EC RoHS norms and regulations. Compliance with chlorine <900ppm,bromine <900ppm, chlorine + bromine <1500ppm
| Characteristics： | Flip chip package |
|---|---|
| Market application： | Consumer Products |
| Market application 2： | General Industry |
| Color： | Black |
| Compliance： | No |
| Brands： | SIL-MORE |
Appearance：Black liquid
Viscosity(mPa.s )：5,200
Storage condition：-40oC~-5oC
Hardness(Shore)：90D
Package：30ML
Application description：BGA,CSP flip-chip package coating epoxy resin
Curing condition：20minute@150℃
Mix ratio：One Part
Volume Resistivity(ohm*cm)：4.5*1015
Specific Gravity(g／cm3)：1.6
Coefficient of Linear Thermal Expansion ( PPM／ ℃ ) ：32
Working Time(@25℃／hr)：3-5Days／72~120hrs
Transition Temperature(Tg)：93℃