SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR Product Catalog

For CSP, BGA chip underfill do, you can buffer the expansion and contraction of the solder ball contact stress, and can be buffered reaction drop test conduction shear.

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Characteristics: High load-carrying capacity
Market application: Consumer Products
Market application 2: Optical Components
Color: Black
Compliance: No
Brands: EP-SIL

Appearance:Black


Viscosity(mPa.s ):3,040


Storage condition:-20℃


Hardness(Shore):77(D)


Package:30ML


Application description:BGA,CSP flip-chip package coating epoxy resin


Curing condition:30minute@80℃or15minute@100℃or10minute@120℃or5minute@150℃


Mix ratio:One Part


Volume Resistivity(ohm*cm):4.5*1015


Specific Gravity(g/cm3):1.218


Coefficient of Linear Thermal Expansion ( PPM/ ℃ ) :80


Working Time(@25℃/hr):5~7 Days


Transition Temperature(Tg):30℃