PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR
Low thermal conductive and long work life
| Characteristics： | Conductive silver glue |
|---|---|
| Market application： | Semiconductor |
| Market application 2： | Optical Components |
| Color： | silver white |
| Compliance： | RoHS／HF |
| Brands： | PROTAVIC |
Appearance：Silver white
Viscosity(mPa.s )：11,700
Package：EFD5cc(17.5g／SYR)
Application description：Suitable for Photo Coupler & DIODES
Curing condition：1Hr@175℃
Mix ratio：One Part
Volume Resistivity(ohm*cm)：3.5E-04
Compliance：RoHS／HF
Shelf life：-40℃@12M
Thermal Conductivity(Watts／meter℃)：2.8
Working Time(@25℃／hr)：72
Transition Temperature(Tg)：130
Thixotropy index：4.94
Modulus(@25°C／@250°C)：3090MPa,438MPa