DOWSIL™ SE 1740 A-B ENCAPSULANT CLEAR
低温固化型
Low temperature curing
Characteristics: | Low temperature curing |
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Market application: | Consumer Products |
Market application 2: | General Industry |
Color: | Transparent |
Compliance: | No |
Brands: | DOWSIL™ |

Transparent
Viscosity(mPa.s ):900
Useful temperature ranges (℃):-45℃~+200℃
Storage condition:25°C(77°F)
Hardness(Shore):0034
Package:18Kg
Application description:Suitable for potting and protecting various electronic devices, especially those with delicate components
Mix ratio:1:1
Volume Resistivity(ohm*cm):17000000000000
Shelf life:12months
Specific Gravity(g/cm3):0.97
Elongation(%):500
Dielectric Strength(KV/mm):17
Thermal Conductivity(Watts/meter℃):0.16
Working Time(@25℃/hr):24Hrs
Specific Gravity(g/ML):2.5