DOWSIL™ SE 1740 A-B ENCAPSULANT CLEAR
低温固化型
Low temperature curing
| Characteristics： | Low temperature curing |
|---|---|
| Market application： | Consumer Products |
| Market application 2： | General Industry |
| Color： | Transparent |
| Compliance： | No |
| Brands： | DOWSIL™ |
Transparent
Viscosity(mPa.s )：900
Useful temperature ranges (℃)：-45℃~+200℃
Storage condition：25°C(77°F)
Hardness(Shore)：0034
Package：18Kg
Application description：Suitable for potting and protecting various electronic devices, especially those with delicate components
Mix ratio：1:1
Volume Resistivity(ohm*cm)：17000000000000
Shelf life：12months
Specific Gravity(g／cm3)：0.97
Elongation(%)：500
Dielectric Strength(KV／mm)：17
Thermal Conductivity(Watts／meter℃)：0.16
Working Time(@25℃／hr)：24Hrs
Specific Gravity(g／ML)：2.5