YINCAE Advanced Materials, LLC: INNOVATON AT ITS BEST

YINCAE is a U.S. company founded in 2005.  The headquarters and manufacturing operations are located in Albany, New York.  The YINCAE brand is a name recognized worldwide as an industry leader in the development of advanced micro-electronic grade materials used in the computer microchip and optoelectronics industries.

YINCAE products are designed to facilitate smarter and faster production for customers at lower costs without sacrificing quality.  We are committed to meeting the demands of rapidly advancing industries while supporting green initiatives. 

YINCAE Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.  The company is founded on three pillars: exceeding performance specifications, maximizing productivity, and lowering process costs for its customers.

  • Product line:
    • Board Level Assembly Material  (SMT series)
    • Underfill Material (SMT series)
    • Die Attach Adhesives (DA90 series)
    • Wafer Level Materials (ACP120 series)
    • Optoelectronic Materials (LEN66 series)
    • Thermal Interface Materials
    • Conformal Coatings (UVC88 series)
  1. YINCAE SMT 256/BP256
    YINCAE SMT 256/BP256

    錫球保護材料, 取代Under Fill

    Applied by Dipping, screen printing and dispensing

    Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

  2. YINCAE SMT 158
    YINCAE SMT 158

    奈米級底部填充

    Filler size <5nm

    Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

  3. YINCAE SMT 256 EP/SMT 138 EP
    YINCAE SMT 256 EP/SMT 138 EP

    Self -leveling and self-soldering adhesives.With higher stable electrical and thermal conductivity, outstanding reliability and easily rework. Eliminate the gassing from the soldering process, flux residues and solder bleed.

  4. YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR
    YINCAE TM 150E HIGH THERMAL SILVER GLUE GRAY,5CC-SYR

    高導熱導電銀膠

    TIM 1, High thermal conductive 60W/mk with oven curing or reflow process