SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK,30ML-SYR Product Catalog

This product is developed for electronic products, flip-chip package with a single-part epoxy resin. Has good operability, can be widely used in electronic products perfusion, caulking and packaging.

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Characteristics: Flip chip package
Market application: Consumer Products
Market application 2: General Industry
Color: Black
Compliance: No
Brands: SIL-MORE
stock number: 1
Price:
$1.00

Appearance:Black liquid


Viscosity(mPa.s ):20,000


Storage condition:-40oC~-5oC


Hardness(Shore):90D


Package:30ML


Application description:BGA,CSP flip-chip package coating epoxy resin


Curing condition:30minute@150℃or10minute@160℃


Mix ratio:One Part


Volume Resistivity(ohm*cm):4.5*1015


Specific Gravity(g/cm3):1.57


Coefficient of Linear Thermal Expansion ( PPM/ ℃ ) :28


Working Time(@25℃/hr):3Days/72hrs


Transition Temperature(Tg):124℃