SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR Product Catalog

This product is developed for electronic products,flip-chip package with a one-part epoxy solvent-free single liquid epoxy resin, completely free of volatile substances,it will not release toxins.

It has good permeability when the temperature is 80oC. After curing has excellent low shrinkage. After curing for gaseous and liquid water has a good resistance. Compliance with EC RoHS norms and regulations. Compliance with chlorine <900ppm,bromine <900ppm, chlorine + bromine <1500ppm

More Information
Characteristics: Flip chip package
Market application: Consumer Products
Market application 2: General Industry
Color: Black
Compliance: No
Brands: SIL-MORE
stock number: 1
Price:
$1.00

Appearance:Black liquid


Viscosity(mPa.s ):5,200


Storage condition:-40oC~-5oC


Hardness(Shore):90D


Package:30ML


Application description:BGA,CSP flip-chip package coating epoxy resin


Curing condition:20minute@150℃


Mix ratio:One Part


Volume Resistivity(ohm*cm):4.5*1015


Specific Gravity(g/cm3):1.6


Coefficient of Linear Thermal Expansion ( PPM/ ℃ ) :32


Working Time(@25℃/hr):3-5Days/72~120hrs


Transition Temperature(Tg):93℃