SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR 產品目錄

本產品是針對電子製品所開發,覆晶封裝用的單液型環氧樹脂 為無溶劑型單液環氧樹脂,完全不含揮發性物質,不會釋放毒素。在溫度80oC時具有良好的滲透性。固化後具有良好的低收縮性。固化後對於氣態和液態的水分都具有良好的抵抗能力。符合EC RoHS法規規範。符合氯<900ppm,溴<900ppm,氯+溴<1500ppm

This product is developed for electronic products,flip-chip package with a one-part epoxy solvent-free single liquid epoxy resin, completely free of volatile substances,it will not release toxins.

It has good permeability when the temperature is 80oC. After curing has excellent low shrinkage. After curing for gaseous and liquid water has a good resistance. Compliance with EC RoHS norms and regulations. Compliance with chlorine <900ppm,bromine <900ppm, chlorine + bromine <1500ppm

產品資訊
特性: 覆晶封裝用
市場應用: 消費性產品
市場應用2: 一般行業(通用產業)
顏色: 黑色
認證:
品牌: SIL-MORE
庫存數量: 1

外觀顏色:黑色液狀


黏度(mPa.s):5,200


儲存條件:-40oC~-5oC


硬度(Shore):90D


包裝:30ML


應用範圍:BGA、CSP覆晶封裝用環氧樹脂


固化條件:20Mins@150℃


混合比:單液型


體積電阻係數(ohm*cm):4.5*1015


密度(g/cm3):1.6


線性熱膨係數:32


工作時間(@25℃/hr):3-5天/Days/72~120hrs


玻璃轉化溫度(Tg):93℃