DOW CORNING OE 8102 LV (EFD) TC DIE ATTACH WHITE,10G-SYR Product Catalog

Thermal conductive/ High thermostability

More Information
Characteristics Thermal conductive
Market application Semiconductor
Market application 2 Optical Components
Color White
Compliance RoHS/HF
Brands DOW

Appearance:White


Viscosity(mPa.s ):5,100


Useful temperature ranges (℃):-45~200


Storage condition:6M@-20℃


Hardness(Shore):D76


Package:10G/SYR


Application description:High thermal die attach and TIM1


Curing condition:150℃x60minute


Mix ratio:One Part


Compliance:RoHS/HF


Shelf life:6Months


Thermal Conductivity(Watts/meter℃):0.6


Working Time(@25℃/hr):8


Light T or R @Thickness (3.2mm):95%(450nm)


Specific Gravity(g/ML):1.9


Die Shear Strength(Mpa)Die Shear Strength(Mpa):9.6


Refractive type:Normal RI


Thixotropy index:6.1