DOW CORNING DA 6534 TC SILICONE DIE ATTACH ADHESIVE GRAY,35G-SYR Product Catalog

Electrically & Thermal Conductive, High thermal conductive/ good adhesion with Ni and Al.

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Characteristics Conductive silver glue
Market application Semiconductor
Market application 2 Optical Components
Color Gray
Compliance No
Brands DOW

Appearance:Gray


Viscosity(mPa.s ):103,000


Useful temperature ranges (℃):-45℃~+200℃


Storage condition:25℃@12months


Hardness(Shore):A91


Package:35G/SYR110G/SYR


Main application:High thermal die attach and TIM1


Application description:Application: MEMS and FCBGA TIM1


Curing condition:120minute@150°C


Mix ratio:One Part


Shelf life:12months


Specific Gravity(g/cm3):4.4


Thermal Conductivity(Watts/meter℃):6.8


Working Time(@25℃/hr):48


Transition Temperature(Tg):-125


Specific Gravity(g/ML):4.4


Thixotropy index:2


Cure conduction:2Hrs@150℃